Hua Hong Semiconductor Limited (HKG: 1347)
15.54
-0.60 (-3.72%)
Sep 9, 2024, 1:25 PM HKT
Hua Hong Semiconductor Dividend Information
Hua Hong Semiconductor has an annual dividend of 0.17 HKD per share, with a yield of 1.02%. The last ex-dividend date was Jun 3, 2024.
Dividend Yield
1.02%
Annual Dividend
0.17 HKD
Ex-Dividend Date
Jun 3, 2024
Payout Frequency
n/a
Payout Ratio
32.90%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 3, 2024 | 0.165 HKD | Jun 26, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.