Hua Hong Semiconductor Limited (HKG:1347)
31.60
-0.95 (-2.92%)
May 30, 2025, 4:08 PM HKT
Hua Hong Semiconductor Dividend Information
Hua Hong Semiconductor has an annual dividend of 0.17 HKD per share, with a yield of 0.53%. The last ex-dividend date was Jun 3, 2024.
Dividend Yield
0.53%
Annual Dividend
0.17 HKD
Ex-Dividend Date
Jun 3, 2024
Payout Frequency
n/a
Payout Ratio
120.66%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 3, 2024 | 0.165 HKD | Jun 26, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.