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Techbond Group Berhad (KLSE: TECHBND)
Malaysia flag Malaysia · Delayed Price · Currency is MYR
0.385
0.00 (0.00%)
At close: Dec 20, 2024

Techbond Group Berhad Dividend Information

Techbond Group Berhad has an annual dividend of 0.01 MYR per share, with a yield of 2.60%. The dividend is paid every six months and the last ex-dividend date was Nov 20, 2024.

Dividend Yield
2.60%
Annual Dividend
0.01 MYR
Ex-Dividend Date
Nov 20, 2024
Payout Frequency
Semi-Annual
Payout Ratio
26.07%
Dividend Growth
100.00%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Nov 20, 20240.010 MYRNov 21, 2024Dec 6, 2024
Jun 12, 20240.005 MYRJun 13, 2024Jul 3, 2024
Nov 30, 20230.0075 MYRDec 1, 2023Dec 15, 2023
Dec 29, 20220.005 MYRDec 30, 2022Jan 17, 2023
Sep 10, 20210.005 MYRSep 13, 2021Sep 30, 2021
Dec 21, 20200.00444 MYRDec 22, 2020Jan 18, 2021
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts