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Techbond Group Berhad (KLSE: TECHBND)
Malaysia flag Malaysia · Delayed Price · Currency is MYR
0.420
0.00 (0.00%)
At close: Sep 9, 2024

Techbond Group Berhad Dividend Information

Techbond Group Berhad has an annual dividend of 0.005 MYR per share, with a yield of 1.19%. The dividend is paid once per year and the last ex-dividend date was Jun 12, 2024.

Dividend Yield
1.19%
Annual Dividend
0.005 MYR
Ex-Dividend Date
Jun 12, 2024
Payout Frequency
Annual
Payout Ratio
41.23%
Dividend Growth
n/a

Dividend History

Ex-Div Date AmountRecord DatePay Date
Jun 12, 20240.005 MYRJun 13, 2024Jul 3, 2024
Nov 30, 20230.0075 MYRDec 1, 2023Dec 15, 2023
Dec 29, 20220.005 MYRDec 30, 2022Jan 17, 2023
Sep 10, 20210.005 MYRSep 13, 2021Sep 30, 2021
Dec 21, 20200.00444 MYRDec 22, 2020Jan 18, 2021
Sep 20, 20190.00889 MYRSep 23, 2019Oct 10, 2019
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts