Shanghai Shibei Hi-Tech Co.,Ltd. (SHA:600604)
5.47
+0.01 (0.18%)
At close: Feb 6, 2026
Shanghai Shibei Hi-Tech Dividend Information
Dividend Yield
0.18%
Annual Dividend
0.01 CNY
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 1, 2025 | 0.010 CNY | Jul 1, 2025 |
| Jul 26, 2023 | 0.005 CNY | Jul 26, 2023 |
| Jul 26, 2022 | 0.007 CNY | Jul 26, 2022 |
| May 25, 2021 | 0.012 CNY | May 25, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.