Hoshine Silicon Industry Co., Ltd. (SHA:603260)
47.76
+0.22 (0.46%)
Oct 27, 2025, 11:29 AM CST
Hoshine Silicon Industry Dividend Information
Hoshine Silicon Industry has an annual dividend of 0.45 CNY per share, with a yield of 0.95%. The dividend is paid once per year and the last ex-dividend date was Aug 19, 2025.
Dividend Yield
0.95%
Annual Dividend
0.45 CNY
Ex-Dividend Date
Aug 19, 2025
Payout Frequency
Annual
Payout Ratio
442.97%
Dividend Growth(1Y)
-33.82%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Aug 19, 2025 | 0.450 CNY | Aug 19, 2025 |
| Aug 19, 2024 | 0.680 CNY | Aug 19, 2024 |
| May 25, 2023 | 0.880 CNY | May 25, 2023 |
| Jun 7, 2022 | 1.510 CNY | Jun 7, 2022 |
| May 26, 2021 | 0.290 CNY | May 26, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.