Hoshine Silicon Industry Co., Ltd. (SHA:603260)
46.72
-1.26 (-2.63%)
Jun 27, 2025, 3:00 PM CST
Hoshine Silicon Industry Dividend Information
Hoshine Silicon Industry has an annual dividend of 0.45 CNY per share, with a yield of 0.96%. The dividend is paid once per year and the last ex-dividend date was Aug 19, 2024.
Dividend Yield
0.96%
Annual Dividend
0.45 CNY
Ex-Dividend Date
Aug 19, 2024
Payout Frequency
Annual
Payout Ratio
130.09%
Dividend Growth(1Y)
-22.73%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Aug 19, 2024 | 0.680 CNY | Aug 19, 2024 |
May 25, 2023 | 0.880 CNY | May 25, 2023 |
Jun 7, 2022 | 1.510 CNY | Jun 7, 2022 |
May 26, 2021 | 0.290 CNY | May 26, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.