Hefei Chipmore Technology Co.,Ltd. Company Description

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits.

The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing, etc., as well as supporting services, such as mask design, COF tape and reel graphic design, test program development, and probe card design and maintenance.

Its packaging and testing products include various display driver chips, power management chips, RF front-end chips, etc. used in high-definition TV, smart phone, automotive electronics, smart wear, electronic communications, industrial control, and other fields.

The company was founded in 2004 and is based in Hefei, China.

Hefei Chipmore Technology Co.,Ltd.

Country	China
Founded	2004
Industry	Semiconductor Equipment & Materials
Sector	Technology
Employees	1,773
CEO	Zongming Yang

Contact Details

Address: Xinzhan Comprehensive Bonded Zone Hefei, 230011 China
Phone	86 512 8818 5678
Website	chipmore.com.cn

Stock Details

Ticker Symbol	688352
Exchange	Shanghai Stock Exchange
Fiscal Year	January - December
Reporting Currency	CNY
ISIN Number	CNE1000060H9
SIC Code	3674

Key Executives

Name	Position
Zongming Yang	GM and Director
Chengqiang Yu	Chief Financial Officer, Deputy GM, Secretary and Director
Xiaoling Zhu	Deputy General Manager
Liangsong Li	Deputy General Manager
Xiaoqing Zhou	Deputy General Manager
Lingling Zhang	Deputy General Manager