Hefei Chipmore Technology Company Description

Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits.

The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing, etc., as well as supporting services, such as mask design, design and maintenance of probe cards, thin film flip chip tape design, and test program development.

Its packaging and testing products include various display driver chips, power management chips, RF front-end chips, etc. used in smart phones, tablets, laptops, high-definition TVs, smart wearables, and other fields.

The company was founded in 2004 and is based in Hefei, China.

Hefei Chipmore Technology Co.,Ltd.

Country	China
Founded	2004
Industry	Semiconductor Equipment & Materials
Sector	Technology
Employees	2,192
CEO	Zongming Yang

Contact Details

Address: No. 2350, Dayu Road Hefei, 230011 China
Phone	86 512 8818 5678
Website	chipmore.com.cn

Stock Details

Ticker Symbol	688352
Exchange	Shanghai Stock Exchange
Fiscal Year	January - December
Reporting Currency	CNY
ISIN Number	CNE1000060H9
SIC Code	3674

Key Executives

Name	Position
Zongming Yang	GM and Director
Chengqiang Yu	Chief Financial Officer, Deputy GM, Board Secretary and Director
Xiaoling Zhu	Deputy General Manager
Xiaoqing Zhou	Deputy General Manager
Lingling Zhang	Deputy General Manager