ChengDu Hi-Tech Development Dividend Information

ChengDu Hi-Tech Development has an annual dividend of 0.15 CNY per share, with a yield of 0.24%. The last ex-dividend date was Aug 23, 2024.

Dividend Yield

0.24%

Annual Dividend

0.15 CNY

Ex-Dividend Date

Aug 23, 2024

Payout Frequency

n/a

Payout Ratio

57.89%

Dividend Growth

n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Aug 23, 2024	0.152 CNY	Aug 22, 2024	Aug 23, 2024
Jun 6, 2023	0.025 CNY	Jun 5, 2023	Jun 6, 2023
Jul 21, 2022	0.030 CNY	Jul 20, 2022	Jul 21, 2022
Jul 8, 2021	0.117 CNY	Jul 7, 2021	Jul 8, 2021

* Dividend amounts are adjusted for stock splits when applicable.