Hunan Goke Microelectronics Co.,Ltd. Dividend Information

Dividend Yield

0.51%

Annual Dividend

0.30 CNY

Ex-Dividend Date

n/a

Payout Frequency

Annual

Payout Ratio

125.33%

Dividend Growth

n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 12, 2024	0.300 CNY	Jun 11, 2024	Jun 12, 2024
Jul 3, 2023	0.300 CNY	Jun 30, 2023	Jul 3, 2023
Jun 2, 2022	0.400 CNY	Jun 1, 2022	Jun 2, 2022
Jul 16, 2021	0.320 CNY	Jul 15, 2021	Jul 16, 2021
Jul 3, 2020	0.100 CNY	Jul 2, 2020	Jul 3, 2020

* Dividend amounts are adjusted for stock splits when applicable.