Winstek Semiconductor Co., Ltd. (TPEX:3265)
Taiwan flag Taiwan · Delayed Price · Currency is TWD
112.50
-1.00 (-0.88%)
Feb 21, 2025, 1:30 PM CST

Winstek Semiconductor Company Description

Winstek Semiconductor Co., Ltd., together with its subsidiaries, provides integrated circuits testing services, and packing services of wafer bumping and wafer in Taiwan.

The company offers test services, such as wafer sort, final and post-test, engineering support, and test platforms services; and bump services, including copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, heterogeneous bump, and backside metallization services.

It also provides backend services comprising die processing, wafer thinning, singulation, and flip chip services; and verification analysis services, such as failure analysis and reliability testing services.

The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015.

The company was founded in 2000 and is headquartered in Hsinchu City, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of SIGWIN Corporation.

Winstek Semiconductor Co., Ltd.
Country Taiwan
Founded 2000
Industry Semiconductor Equipment & Materials
Sector Technology
CEO Chih Li Weng

Contact Details

Address:
Qionglin Township
Hsinchu City, 307410
Taiwan
Phone 886 3 593 6565
Website winstek.com.tw

Stock Details

Ticker Symbol 3265
Exchange Taipei Exchange
Stock Type Common Stock
Fiscal Year January - December
Reporting Currency TWD
ISIN Number TW0003265005
SIC Code 3674

Key Executives

Name Position
Chih Li Weng President, GM and Director
Kui-Chu Liu Chief Financial Officer, Accounting Officer and Finance Division Deputy Director
Il Kwon Shim Chief Technology Officer and Senior Vice President