Company Description
Amtech Systems, Inc., together with its subsidiaries, manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide, silicon power devices, digital and analog devices, power electronic and semiconductor packages, and electronic assemblies in the United States, Canada, Mexico, China, Malaysia, Taiwan, the Czech Republic, Austria, Germany, and internationally.
It operates through Thermal Processing Solutions and Semiconductor Fabrication Solutions segments. The company offers thermal processing equipment for use in solder reflow operations for advanced semiconductor packaging and electronics assembly; high-temperature belt furnaces for use in producing power semiconductor packaging substrates and electronic components; and horizontal diffusion furnaces for use in wafer processing.
It also provides double-sided wafer cleaning systems, entegrity head testers, substrate carriers, substrate polishing templates, substrate process chemicals, wafer processing lubricants, and coolants under the Entrepix, PR Hoffman, and Intersurface Dynamics brands.
The company sells its products to semiconductor substrate, device, electronic assembly, and module manufacturers through sales personnel and a network of independent sales representatives and distributors.
Amtech Systems, Inc. was founded in 1981 and is headquartered in Tempe, Arizona.
| Country | United States |
| Founded | 1981 |
| Industry | Semiconductor Equipment & Materials |
| Sector | Technology |
| Employees | 328 |
| CEO | Robert Daigle |
Contact Details
Address: 58 South River Drive, Suite 370 Tempe, Arizona 85288 United States | |
| Phone | 480 967 5146 |
| Website | amtechsystems.com |
Stock Details
| Ticker Symbol | ASYS |
| Exchange | NASDAQ |
| Fiscal Year | October - September |
| Reporting Currency | USD |
| CIK Code | 0000720500 |
| CUSIP Number | 032332504 |
| ISIN Number | US0323325045 |
| Employer ID | 86-0411215 |
| SIC Code | 3559 |
Key Executives
| Name | Position |
|---|---|
| Robert C. Daigle | President, Chairman and Chief Executive Officer |
| Wade Michael Jenke | Chief Financial Officer |
| Jason Brown | Vice President of Operations |
| Paul Lancaster | Vice President of Sales and Corporate Development |
| Angi Larson | Chief Human Resources Officer |
| Shashi Gupta | Senior Vice President and GM of Semiconductor Fabrication Solutions |
Latest SEC Filings
| Date | Type | Title |
|---|---|---|
| Dec 12, 2024 | 10-K | Annual Report |
| Dec 9, 2024 | 8-K | Current Report |
| Nov 12, 2024 | SC 13G | Statement of acquisition of beneficial ownership by individuals |
| Oct 31, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Oct 15, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Sep 17, 2024 | 8-K | Current Report |
| Sep 6, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Aug 7, 2024 | 8-K | Current Report |
| Aug 7, 2024 | 10-Q | Quarterly Report |
| May 29, 2024 | SD | Form - SD |