Company Description
Amtech Systems, Inc. manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide (SiC), silicon power devices, analog and discrete devices, electronic assemblies, and light-emitting diodes (LEDs) worldwide.
The company operates through Semiconductor and Material and Substrate segments. The Semiconductor segment designs, manufactures, sells, and services thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics, and electro/mechanical assembly manufacturers; and diffusion and reflow thermal systems, as well as wafer cleaning equipment and related services.
The Material and Substrate segment manufactures and sells consumables and machinery for lapping and polishing of materials, such as silicon wafers for semiconductor products; sapphire substrates for LED lighting and mobile devices; silicon carbide wafers for LED and power device applications; various glass and silica components for 3D image transmission; quartz and ceramic components for telecommunications devices; and medical device components, and optical and photonics applications.
It also offers substrate products comprising of double-sided wafer cleaning system, entegrity head tester, substrate carrier, substrate polishing templates, double-sided lapping and polishing machines, single-sided polisher, and substrate process chemicals.
The company sells its products through sales personnel, as well as a network of independent sales representatives and distributors.
Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.
| Country | United States |
| Founded | 1981 |
| Industry | Semiconductor Equipment & Materials |
| Sector | Technology |
| Employees | 405 |
| CEO | Robert Daigle |
Contact Details
Address: 131 South Clark Drive Tempe, Arizona 85288 United States | |
| Phone | 480 967 5146 |
| Website | amtechsystems.com |
Stock Details
| Ticker Symbol | ASYS |
| Exchange | NASDAQ |
| Fiscal Year | October - September |
| Reporting Currency | USD |
| CIK Code | 0000720500 |
| CUSIP Number | 032332504 |
| ISIN Number | US0323325045 |
| Employer ID | 86-0411215 |
| SIC Code | 3559 |
Key Executives
| Name | Position |
|---|---|
| Robert C. Daigle | President, Chairman and Chief Executive Officer |
| Wade Michael Jenke | Chief Financial Officer |
| Jason Brown | Vice President of Operations |
| Paul Lancaster | Vice President of Sales and Corporate Development |
| Angi Larson | Chief Human Resources Officer |
| Shashi Gupta | Senior Vice President and GM of Semiconductor Fabrication Solutions |
Latest SEC Filings
| Date | Type | Title |
|---|---|---|
| Nov 12, 2024 | SC 13G | Statement of acquisition of beneficial ownership by individuals |
| Oct 31, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Oct 15, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Sep 17, 2024 | 8-K | Current Report |
| Sep 6, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
| Aug 7, 2024 | 8-K | Current Report |
| Aug 7, 2024 | 10-Q | Quarterly Report |
| May 29, 2024 | SD | Form - SD |
| May 14, 2024 | SC 13D/A | [Amend] General statement of acquisition of beneficial ownership |
| May 8, 2024 | 10-Q | Quarterly Report |