Hi, good afternoon, everybody. Thanks for joining us. I'm Rick Schaefer, Oppenheimer Semiconductor Analyst, joined today by Anthony Pappone, VP of FP&A and IR . Anthony's been part of the IR team since 2023, I believe. Anthony, great as always to see you. Thanks for joining us. I will turn the floor over to you.
Okay, thanks, Rick. Hello, everyone. Thanks for joining me today. Before I begin, as a reminder, just please take a moment to review our safe harbor statement on slide two. For today's presentation, I'll start with a quick overview of Veeco, speak about our role in the semiconductor space, discuss our served available market, share our current evaluation systems and our technology role in AI. I'll move over to our semiconductor market, provide an overview of our historical revenue, and lastly, end with why Veeco is a strategic investment opportunity. Who is Veeco? Our company has a long track record of success in data storage in the 1990s. Veeco demonstrated industry leadership with our ion beam technology to manufacture thin film magnetic heads that are used today. We grew this portion of our business and then expanded into compound semi, where in compound semi, Veeco saw tremendous growth with our MOCVD tools that were used for the technology to make LEDs, specifically LED TV backlighting and LED general lighting applications. Our technology enabled mass adoption of LED lighting throughout the world. In 2018, when Bill became CEO, our LED business became largely commoditized, and as a result, we had to significantly transform the company. We developed a strategy to utilize our core technologies in the markets with the highest return on investment, including the semi market. The technology we had in the semiconductor market, through the acquisition of UltraTech, was best in class. However, prior to the acquisition of UltraTech, UltraTech fell out of favor with the tier one semi providers due to their inability to substantially support the customers. Bill, with the strength of the Veeco infrastructure, was able to re-engage these tier one leading semi manufacturers and subsequently turn them back into customers. With Veeco's focus on leading edge customers, we were able to expand the business and transform into a semiconductor capital equipment provider with technologies enabling advanced semiconductor chips for AI and high-performance computing. Now I'll discuss Veeco's role in semiconductor manufacturing. Our technology is critical for several leading edge semi manufacturing steps for both current and future applications. I'm going to walk through this chart from left to right. To begin, our IBD 300 system, which is currently being evaluated for differentiated technologies, achieves improved thin film properties with critical metals, which can directly impact device performance, speed, and battery life. Next, I'm moving over to the IBD for EUV mask blank production. We're the market leader for deposition of defect-free films for EUV mask blanks. Our ion beam deposition technology is critical to the industry's roadmaps, and we're in a strong position to support demand for EUV lithography. We see opportunities to expand our business into adjacent mask blank steps. We're a market leader in laser annealing with our laser spike annealing systems qualified as production tool of record for leading logic customers and one tier one DRAM customer. Our next-generation nanosecond annealing system expands our capabilities to enable new applications. Moving to advanced packaging, our processing systems are production tool of record at a number of leading customers, and we continue to expand with application wins. In advanced packaging lithography, we sell to several IDMs and OSATS customers with several applications. Now I'm going to transition to discuss Veeco's semiconductor market position. Our semiconductor SAM is about $1.3 billion today, which we see doubling to more than $2.7 billion as our core laser annealing, nanosecond annealing, and IBD technologies continue to gain traction. Our LSA platform is production tool of record at all leading logic customers and one memory customer's advanced nodes and is continuing to expand to new applications. We see opportunity for our LSA SAM to grow to $800 million, driven by industry inflections in logic and memory, resulting in an increase in laser annealing intensity. Our NSA platform is being evaluated for multiple applications at two tier one logic customers, and we have a strong pull from a third tier one logic customer. We expect the SAM to grow to approximately $450 million. We expect LSA adoption in memory and adoption of our NSA system for advanced applications in logic and memory to be key growth drivers. In ion beam deposition for EUV mask blanks, leading logic and memory customers expect EUV and high NA EUV lithography to be integral to their roadmaps, contributing to projected SAM growth to $120 million. In IBD 300, we have opportunities to expand our SAM to $350 million for our high-value front-end semi applications requiring critical film performance. We have two evaluations outstanding with memory customers and pull from customers in logic as well. In advanced packaging, we see potential SAM growth to $650 million for our enabling wet processing solutions and lithography for a growing number of applications supporting AI and high-performance computing. The next two slides are going to discuss two of our largest opportunities, two of the opportunities that are currently out for evaluation right now. First, I'm going to start with our NSA tool. Our NSA tool offers a substantial opportunity to expand our SAM to a broad range of new advanced node applications in both logic and memory. Our NSA system's unique laser and architecture results in a shorter dwell time versus today's most advanced annealing solutions. The dwell time is the length of time the wafer is subject to heat of the laser. These capabilities can help customers address scaling challenges through a more precise and shallower annealing and are ideal for steps such as backside power delivery, contact anneal for advanced nodes, and 3D devices. We expect nanosecond annealing to be complementary to our current laser annealing systems, as we expect both technologies to be utilized at advanced nodes for different steps. Now moving to our ion beam deposition system for thin film for low resistant metals. Our core ion beam technology has been honed over decades and is the technology of choice in the semiconductor industry for EUV mask blank production. The semi roadmap is turning to new technologies and materials to enable continued device shrinks and address growing need for energy efficient compute performance. Low resistant metals are increasingly critical to maintain device performance as customers look to scale via device shrink and traditional deposition technologies are reaching their limits. Our IBD 300 system can achieve lower resistivity through improved thin film properties for critical metals, which can benefit our customers through improved device performance and speed. I'd now like to provide additional detail on our evaluation program and its importance in capturing several of our largest opportunities. Our evaluation program has been essential to penetrating new opportunities in the front-end semi market, and we had several evaluation systems outstanding at tier one logic and memories, as I stated earlier. This slide shows the semi evaluation systems currently at both logic and memory customers. We're seeing strong customer engagement across multiple evaluations, which are targeting a range of high-valued applications. Each application win has the potential to generate $30 million- $60 million follow-on business, assuming 100,000 wafer starts per month. Our evaluations in the field are progressing well and continuing to invest in additional systems to drive new business in both logic and memory. We expect to ship an LSA evaluation system to a second tier one DRAM customer later this year, along with an NSA evaluation system to a third logic customer. We also see potential for additional NSA and IBD 300 evaluation systems in 2026. Now I'd like to turn to our opportunities in AI and how all of this, this semi equipment that we're just speaking about, how it applies to AI. AI is requiring the most advanced technologies to manufacture higher performance chips, and we're seeing growing adoption of our products in three main areas. Our laser annealing systems are used for GPU and CPU production at all leading logic customers' most advanced nodes. For HBM DRAM, our first customer has adopted our LSA system for both the logic die and the peripheral logic on each HBM DRAM die. In ion beam deposition, our IBD systems enable mask blank production for both GPUs and HBM DRAM. Equally as important, we're seeing future opportunities for our nanosecond annealing and ion beam deposition solutions for both GPU and HBM. In wet processing, our systems support advanced packaging for AI by enabling flux cleaning of microbumps at leading foundry and memory customers, as well as OSATs with similar packaging processes. Notably in this area of the business, we are seeing strength, and we see AI revenue increasing from about 10% in 2024 to about 20% in 2025. Now I'd just like to briefly turn to our compound semi opportunities. In the compound semiconductor market, we see SAM today of nearly $700 million, and we expect it to grow to $1.2 billion. GaN power devices are common in customer electronics for applications like fast charging, wireless charging, and other automotive applications, and we believe we'll be well positioned as the market continues to expand. We shipped the 300 mm eval to tier one power device customers in 2024, which is an exciting opportunity, and we're seeing this market growing from $100 million to $300 million. We're also excited about our opportunities in photonics in areas like microLEDs and solar applications, and see this market growing from $150 million to $400 million. I'll now transition to discuss our historical revenue by end markets. Investment in core technologies in the semi market has been a significant focus for the company. We've had a great deal of success in growing our semi business over the last few years, and from 2020 to 2024, the business has grown at an approximate 30% CAGR. We continue to see potential for growth in semi in 2025, particularly in leading edge investments driven by AI and high-performance computing. Beyond 2025, our outlook remains strong in the semiconductor market, supported by a differentiated product portfolio across laser annealing, ion beam deposition, wet processing, and thin film. In compound semiconductor and data storage markets, although revenue is expected to decline in 2025 compared to 2024, we are seeing encouraging signs. In compound semi, customers' interest in GaN power and photonics has been increasing, and we see these emerging opportunities to begin contributing to revenue growth in 2026. In data storage, we're encouraged by increased engagement and commercial discussions around future requirements. I'm going to conclude with the key takeaways of why we believe Veeco is a compelling investment opportunity. First, some industry analysts and leading equipment providers project growth in the semi industry to over $1 trillion by 2030, contributing to expectations for long-term growth in wafer fab equipment spending. Second, Veeco has a portfolio of enabling technologies that are increasingly critical for several leading edge semi manufacturing process steps. Third, our strategy of investing in core technologies to enable industry inflections in advanced logic and memory continues to gain traction. Fourth, we believe our exposure to these high growth areas of the market can enable our SAM to grow faster than growth in WFE spending. Finally, we expect our execution to generate long-term value for Veeco. I'd just like to thank everyone for joining me today, and this will conclude our presentation. If you have any questions or follow-ups, please reach out to Investor Relations. We'll be happy to take your calls. Thank you.
Thanks, Anthony. Great to see you.
Great to see you, Rick. Thank you.