BE Semiconductor Industries N.V. (AMS:BESI)
Netherlands flag Netherlands · Delayed Price · Currency is EUR
156.30
-32.35 (-17.15%)
At close: Mar 6, 2026

BE Semiconductor Industries Company Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally.

It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems.

It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services.

The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies.

BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

BE Semiconductor Industries N.V.
BE Semiconductor Industries logo
CountryNetherlands
Founded1995
IndustrySemiconductor Equipment & Materials
SectorTechnology
Employees1,856
CEORichard Blickman

Contact Details

Address:
Ratio 6
Duiven, 6921 RW
Netherlands
Phone31 26 319 4500
Websitebesi.com

Stock Details

Ticker SymbolBESI
ExchangeEuronext Amsterdam
Fiscal YearJanuary - December
Reporting CurrencyEUR
ISIN NumberNL0012866412
SIC Code3559

Key Executives

NamePosition
Richard W. BlickmanChairman of Management Board, President and Chief Executive Officer
Andrea Kopp-BattagliaSenior Vice President of Finance
Henk-Jan Jonge PoerinkSenior Vice President of Global Operations
Chris ScanlanSenior Vice President of Technology
Edmond FrancoVice President of Corporate Development
Rene W. HendriksSenior Vice President of Sales - North America and Europe
Peter WiednerSenior Vice President of Sub Micron Die Attach
Jong Kwon ParkSenior Vice President of Sales and Customer Support - APAC
Jeroen KleijburgSenior Vice President of Packaging
Christoph ScheiringSenior Vice President of Die Attach