Netherlands
· Delayed Price · Currency is EUR BESI Company Description
BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally.
It operates through three segments: Die Attach, Packaging, and Plating. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems.
It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services.
The company’s principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.
BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
| Country | Netherlands |
| Founded | 1995 |
| Industry | Semiconductor Equipment & Materials |
| Sector | Technology |
| Employees | 1,736 |
| CEO | Richard Blickman |
Contact Details
Address: Ratio 6 Duiven, 6921 RW Netherlands | |
| Phone | 31 26 319 4500 |
| Website | besi.com |
Stock Details
| Ticker Symbol | BESI |
| Exchange | Euronext Amsterdam |
| Fiscal Year | January - December |
| Reporting Currency | EUR |
| ISIN Number | NL0012866412 |
| SIC Code | 3559 |
Key Executives
| Name | Position |
|---|---|
| Richard W. Blickman | Chairman of Management Board, President and Chief Executive Officer |
| Andrea Kopp-Battaglia | Senior Vice President of Finance |
| Henk-Jan Jonge Poerink | Senior Vice President of Global Operations |
| Chris Scanlan | Senior Vice President of Technology |
| Edmond Franco | Vice President of Corporate Development |
| Rene W. Hendriks | Senior Vice President of Sales - North America and Europe |
| Peter Wiedner | Senior Vice President of Sub Micron Die Attach |
| Jong Kwon Park | Senior Vice President of Sales and Customer Support - APAC |
| Jeroen Kleijburg | Senior Vice President of Packaging |
| Christoph Scheiring | Senior Vice President of Die Attach |