ChipMOS TECHNOLOGIES INC. Company Description

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of China, Singapore, and internationally.

The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others.

It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages.

The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices.

In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology.

Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment.

Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics.

The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

ChipMOS TECHNOLOGIES INC.

Country	Taiwan
Founded	1997
Industry	Semiconductors
Sector	Technology
Employees	5,688
CEO	Shih-Jye Cheng

Contact Details

Address: No.1, Yanfa 1st Road Hsinchu City Taiwan
Phone	886 3 577 0055
Website	chipmos.com

Stock Details

Ticker Symbol	CPIA
Exchange	Frankfurt Stock Exchange
Fiscal Year	January - December
Reporting Currency	TWD
ISIN Number	US16965P2020
SIC Code	3679

Key Executives

Name	Position
Shih-Jye Cheng	Chief Executive Officer
Silvia Su	Chief Financial Officer
Jesse Huang	Head of Investor Relations