Hing Lee (HK) Holdings Limited (HKG:0396)
0.3050
+0.0200 (7.02%)
At close: Mar 27, 2026
Hing Lee (HK) Holdings Dividend Information
Hing Lee (HK) Holdings has an annual dividend of 0.03 HKD per share, with a yield of 9.84%. The dividend is paid once per year and the next ex-dividend date is May 11, 2026.
Dividend Yield
9.84%
Annual Dividend
0.03 HKD
Ex-Dividend Date
May 11, 2026
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 11, 2026 | 0.015 HKD | May 22, 2026 |
| Aug 28, 2025 | 0.010 HKD | Sep 9, 2025 |
| Aug 20, 2024 | 0.0751 HKD | Aug 30, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.