Duksan Hi Metal Co.,Ltd Company Description
Duksan Hi Metal Co.,Ltd engages in the manufacturing and sale of soldering materials for semiconductor packaging applications in South Korea.
The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic component keep being developed; and solder powder, a substance of solder paste that is used for soldering PCBs and devices.
It also provides anisotropic conductive film (ACF) for directional electrical contact and chemical bonding, such as display, drive IC, PCB, etc.; conductive particle, a component of ACF that anisotropically controls electrical current; cored solder ball, which forms bumps between a substrate and a chip; low alpha tin for solving the problem of soft errors occurred in chips; silver nanowires; thermally conductive pastes; and EMI shielding pastes.
The company was founded in 1999 and is headquartered in Ulsan, South Korea. Duksan Hi Metal Co.,Ltd is a subsidiary of DUKSAN group.
Country | South Korea |
Founded | 1999 |
Industry | Semiconductors and Related Devices |
Employees | 188 |
Contact Details
Address: 66, Muryong 1-ro Ulsan, 44252 South Korea | |
Phone | 82 5 2283 9000 |
Website | dshm.co.kr |
Stock Details
Ticker Symbol | 077360 |
Exchange | KOSDAQ |
Fiscal Year | January - December |
Reporting Currency | KRW |
SIC Code | 3674 |