BE Semiconductor Industries N.V. (LON:0XVE)
London flag London · Delayed Price · Currency is GBP · Price in EUR
125.07
+2.38 (1.94%)
At close: Jul 17, 2025

BE Semiconductor Industries Company Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally.

It operates through three segments: Die Attach, Packaging, and Plating. The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die bonding, die lid attach, and fan out wafer level packaging; packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems.

It also provides plating equipment comprising tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services.

The company’s brand names include Datacon, Esec, Fico, and Meco. It serves multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.

BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

BE Semiconductor Industries N.V.
CountryNetherlands
Founded1995
IndustrySpecial Industry Machinery, not elsewhere classified
Employees1,812
CEORichard Blickman

Contact Details

Address:
Ratio 6
Duiven, 6921 RW
Netherlands
Phone31 26 319 4500
Websitebesi.com

Stock Details

Ticker Symbol0XVE
ExchangeLondon Stock Exchange
Fiscal YearJanuary - December
Reporting CurrencyEUR
ISIN NumberNL0012866412
SIC Code3559

Key Executives

NamePosition
Richard W. BlickmanChairman of Management Board, President and Chief Executive Officer
Andrea Kopp-BattagliaSenior Vice President of Finance
Henk-Jan Jonge PoerinkSenior Vice President of Global Operations
Chris ScanlanSenior Vice President of Technology
Edmond FrancoVice President of Corporate Development
Rene W. HendriksSenior Vice President of Sales - North America and Europe
Peter WiednerSenior Vice President of Sub Micron Die Attach
Jong Kwon ParkSenior Vice President of Sales and Customer Support - APAC
Jeroen KleijburgSenior Vice President of Packaging
Christoph ScheiringSenior Vice President of Die Attach