SIA Engineering Company Limited (SEGSF)

SEGSF Dividend Information

SIA Engineering Company has an annual dividend of $0.085 per share, with a yield of 3.16%. The dividend is paid every six months and the last ex-dividend date was Jul 29, 2026.

• Dividend Yield: 3.16%
• Annual Dividend: $0.085
• Ex-Dividend Date: Jul 29, 2026
• Payout Frequency: Semi-Annual
• Payout Ratio: 62.99%
• Dividend Growth: 22.07%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jul 29, 2026	$0.06581	Jul 30, 2026	Aug 14, 2026
Nov 11, 2025	$0.01919	Nov 12, 2025	Nov 28, 2025
Jul 28, 2025	$0.05464	Jul 29, 2025	Aug 12, 2025
Nov 12, 2024	$0.01499	Nov 13, 2024	Nov 29, 2024
Jul 25, 2024	$0.04472	Jul 26, 2024	Aug 14, 2024

* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts

Data Source: S&P Global Market Intelligence Last updated: Jul 29, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every six months for this company.

Update frequency:

Semi-annually

Last checked:

Aug 31, 2026

Data Sources Report a data error

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