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SIA Engineering Company Limited (SEGSF)
OTCMKTS · Delayed Price · Currency is USD
2.694
+0.144 (5.65%)
At close: Jun 29, 2026

SEGSF Dividend Information

SIA Engineering Company has an annual dividend of $0.085 per share, with a yield of 3.17%. The dividend is paid every six months and the next ex-dividend date is Nov 11, 2026.

Dividend Yield
3.17%
Annual Dividend
$0.085
Ex-Dividend Date
Nov 11, 2026
Payout Frequency
Semi-Annual
Payout Ratio
73.61%
Dividend Growth
15.52%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Nov 11, 2026$0.01948Nov 12, 2026Nov 27, 2026
Jul 29, 2026$0.06581Jul 30, 2026Aug 14, 2026
Nov 11, 2025$0.01919Nov 12, 2025Nov 28, 2025
Jul 28, 2025$0.05464Jul 29, 2025Aug 12, 2025
Nov 12, 2024$0.01499Nov 13, 2024Nov 29, 2024
Jul 25, 2024$0.04472Jul 26, 2024Aug 14, 2024
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts