SIA Engineering Company Limited (SEGSF)
OTCMKTS · Delayed Price · Currency is USD
2.694
0.00 (0.00%)
Sep 3, 2025, 3:11 PM EST
SEGSF Dividend Information
SIA Engineering Company has an annual dividend of $0.085 per share, with a yield of 3.16%. The dividend is paid every six months and the last ex-dividend date was Jul 29, 2026.
Dividend Yield
3.16%
Annual Dividend
$0.085
Ex-Dividend Date
Jul 29, 2026
Payout Frequency
Semi-Annual
Payout Ratio
62.99%
Dividend Growth(1Y)
22.07%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 29, 2026 | $0.06581 | Aug 14, 2026 |
| Nov 11, 2025 | $0.01919 | Nov 28, 2025 |
| Jul 28, 2025 | $0.05464 | Aug 12, 2025 |
| Nov 12, 2024 | $0.01499 | Nov 29, 2024 |
| Jul 25, 2024 | $0.04472 | Aug 14, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.