Shanghai Research Institute of Building Sciences Group Co., Ltd. (SHA:603153)
17.09
-0.08 (-0.47%)
At close: May 30, 2025, 2:57 PM CST
SHA:603153 Dividend Information
SHA:603153 has an annual dividend of 0.26 CNY per share, with a yield of 1.49%. The dividend is paid once per year and the last ex-dividend date was Jun 14, 2024.
Dividend Yield
1.49%
Annual Dividend
0.26 CNY
Ex-Dividend Date
Jun 14, 2024
Payout Frequency
Annual
Payout Ratio
27.99%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 14, 2024 | 0.240 CNY | Jun 14, 2024 |
Jul 7, 2023 | 0.210 CNY | Jul 7, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.