Shanghai Research Institute of Building Sciences Group Co., Ltd. (SHA:603153)
17.75
+0.05 (0.28%)
Jan 19, 2026, 4:00 PM EST
SHA:603153 Dividend Information
SHA:603153 has an annual dividend of 0.26 CNY per share, with a yield of 1.45%. The dividend is paid once per year and the last ex-dividend date was Jul 23, 2025.
Dividend Yield
1.45%
Annual Dividend
0.26 CNY
Ex-Dividend Date
Jul 23, 2025
Payout Frequency
Annual
Payout Ratio
27.44%
Dividend Growth(1Y)
6.25%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 23, 2025 | 0.255 CNY | Jul 23, 2025 |
| Jun 14, 2024 | 0.240 CNY | Jun 14, 2024 |
| Jul 7, 2023 | 0.210 CNY | Jul 7, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.