Shanghai Research Institute of Building Sciences Group Co., Ltd. (SHA:603153)
12.91
-0.13 (-1.00%)
At close: Jul 24, 2026
SHA:603153 Dividend Information
SHA:603153 has an annual dividend of 0.27 CNY per share, with a yield of 2.09%. The dividend is paid once per year and the next ex-dividend date is Jul 29, 2026.
Dividend Yield
2.09%
Annual Dividend
0.27 CNY
Ex-Dividend Date
Jul 29, 2026
Payout Frequency
Annual
Payout Ratio
29.78%
Dividend Growth(1Y)
5.88%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 29, 2026 | 0.270 CNY | Jul 29, 2026 |
| Jul 23, 2025 | 0.255 CNY | Jul 23, 2025 |
| Jun 14, 2024 | 0.240 CNY | Jun 14, 2024 |
| Jul 7, 2023 | 0.210 CNY | Jul 7, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.