Shanghai Bloom Technology Inc (SHA:603325)
52.99
+0.61 (1.16%)
Jul 31, 2026, 3:00 PM CST
Shanghai Bloom Technology Dividend Information
Shanghai Bloom Technology has an annual dividend of 1.60 CNY per share, with a yield of 3.02%. The dividend is paid every six months and the last ex-dividend date was Jul 14, 2026.
Dividend Yield
3.02%
Annual Dividend
1.60 CNY
Ex-Dividend Date
Jul 14, 2026
Payout Frequency
Semi-Annual
Payout Ratio
28.93%
Dividend Growth(1Y)
28.00%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 14, 2026 | 1.000 CNY | Jul 14, 2026 |
| Dec 25, 2025 | 0.600 CNY | Dec 25, 2025 |
| Jul 23, 2025 | 0.750 CNY | Jul 23, 2025 |
| Jan 23, 2025 | 0.500 CNY | Jan 23, 2025 |
| Jul 3, 2024 | 1.08333 CNY | Jul 3, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.