Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
23.73
+0.19 (0.81%)
At close: Jan 23, 2026
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.20 CNY per share, with a yield of 0.84%. The dividend is paid once per year and the last ex-dividend date was Jun 11, 2025.
Dividend Yield
0.84%
Annual Dividend
0.20 CNY
Ex-Dividend Date
Jun 11, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
833.27%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 11, 2025 | 0.200 CNY | Jun 11, 2025 |
| Jul 12, 2024 | 0.02143 CNY | Jul 12, 2024 |
| Sep 19, 2023 | 0.01786 CNY | Sep 19, 2023 |
| Jun 28, 2023 | 0.01071 CNY | Jun 28, 2023 |
| Jul 1, 2020 | 0.05714 CNY | Jul 1, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.