Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
16.17
-0.08 (-0.49%)
Jul 18, 2025, 2:45 PM CST
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.043 CNY per share, with a yield of 0.27%. The dividend is paid once per year and the last ex-dividend date was Jun 11, 2025.
Dividend Yield
0.27%
Annual Dividend
0.043 CNY
Ex-Dividend Date
Jun 11, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
833.27%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 11, 2025 | 0.200 CNY | Jun 11, 2025 |
Jul 12, 2024 | 0.02143 CNY | Jul 12, 2024 |
Sep 19, 2023 | 0.01786 CNY | Sep 19, 2023 |
Jun 28, 2023 | 0.01071 CNY | Jun 28, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.