Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
21.02
-0.13 (-0.61%)
Jun 3, 2025, 2:45 PM CST
SHA:603499 Dividend Information
Dividend Yield
0.28%
Annual Dividend
0.06 CNY
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
n/a
Dividend Growth(1Y)
266.67%
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jul 12, 2024 | 0.030 CNY | Jul 12, 2024 |
Sep 19, 2023 | 0.025 CNY | Sep 19, 2023 |
Jun 28, 2023 | 0.015 CNY | Jun 28, 2023 |
Jul 1, 2020 | 0.080 CNY | Jul 1, 2020 |
* Dividend amounts are adjusted for stock splits when applicable.