Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
19.90
-0.51 (-2.50%)
Jun 18, 2026, 3:00 PM CST
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.08 CNY per share, with a yield of 0.39%. The dividend is paid once per year and the next ex-dividend date is Jun 22, 2026.
Dividend Yield
0.39%
Annual Dividend
0.08 CNY
Ex-Dividend Date
Jun 22, 2026
Payout Frequency
Annual
Payout Ratio
47.41%
Dividend Growth(1Y)
-60.00%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 22, 2026 | 0.080 CNY | Jun 22, 2026 |
| Jun 11, 2025 | 0.200 CNY | Jun 11, 2025 |
| Jul 12, 2024 | 0.02143 CNY | Jul 12, 2024 |
| Sep 19, 2023 | 0.01786 CNY | Sep 19, 2023 |
| Jun 28, 2023 | 0.01071 CNY | Jun 28, 2023 |
* Dividend amounts are adjusted for stock splits when applicable.