Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
11.10
+0.25 (2.30%)
Oct 23, 2026, 3:00 PM CST
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.057 CNY per share, with a yield of 0.51%. The dividend is paid once per year and the last ex-dividend date was Jun 22, 2026.
Dividend Yield
0.51%
Annual Dividend
0.057 CNY
Ex-Dividend Date
Jun 22, 2026
Payout Frequency
Annual
Payout Ratio
19.60%
Dividend Growth(1Y)
-44.00%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.