Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
13.85
+0.19 (1.39%)
Sep 14, 2026, 3:00 PM CST
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.057 CNY per share, with a yield of 0.42%. The dividend is paid once per year and the last ex-dividend date was Jun 22, 2026.
Dividend Yield
0.42%
Annual Dividend
0.057 CNY
Ex-Dividend Date
Jun 22, 2026
Payout Frequency
Annual
Payout Ratio
23.51%
Dividend Growth(1Y)
-44.00%
Dividend History
Pro Feature
Extended Dividend History
Get 10-50+ years of dividend history with additional data points and many more features. Available with a paid plan starting at $6.58 per month.
* Dividend amounts are adjusted for stock splits when applicable.