Shanghai Sunglow Packaging Technology Co.,Ltd (SHA:603499)
11.63
-0.09 (-0.77%)
Aug 25, 2026, 10:45 AM CST
SHA:603499 Dividend Information
SHA:603499 has an annual dividend of 0.057 CNY per share, with a yield of 0.46%. The dividend is paid once per year and the last ex-dividend date was Jun 22, 2026.
Dividend Yield
0.46%
Annual Dividend
0.057 CNY
Ex-Dividend Date
Jun 22, 2026
Payout Frequency
Annual
Payout Ratio
23.51%
Dividend Growth(1Y)
-44.00%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.