Tangshan Sunfar Silicon Industries Co.,Ltd. (SHA:603938)
China · Delayed Price · Currency is CNY 14.82
+0.04 (0.27%)
Jul 18, 2025, 2:45 PM CST
SHA:603938 Dividend Information
SHA:603938 has an annual dividend of 0.017 CNY per share, with a yield of 0.11%. The dividend is paid once per year and the last ex-dividend date was Jun 13, 2025.
Dividend Yield
0.11%
Annual Dividend
0.017 CNY
Ex-Dividend Date
Jun 13, 2025
Payout Frequency
Annual
Payout Ratio
32.87%
Dividend Growth(1Y)
-67.31%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 13, 2025 | 0.017 CNY | Jun 13, 2025 |
| May 28, 2024 | 0.052 CNY | May 28, 2024 |
| May 11, 2023 | 0.275 CNY | May 11, 2023 |
| May 12, 2022 | 0.12286 CNY | May 12, 2022 |
| Apr 23, 2021 | 0.04082 CNY | Apr 23, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.