Tangshan Sunfar Silicon Industries Co.,Ltd. (SHA:603938)

SHA:603938 Dividend Information

SHA:603938 has an annual dividend of 0.022 CNY per share, with a yield of 0.05%. The dividend is paid once per year and the last ex-dividend date was Jun 9, 2026.

• Dividend Yield: 0.05%
• Annual Dividend: 0.022 CNY
• Ex-Dividend Date: Jun 9, 2026
• Payout Frequency: Annual
• Payout Ratio: 5.21%
• Dividend Growth: 29.41%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 9, 2026	0.022 CNY	Jun 8, 2026	Jun 9, 2026
Jun 13, 2025	0.017 CNY	Jun 12, 2025	Jun 13, 2025
May 28, 2024	0.052 CNY	May 27, 2024	May 28, 2024
May 11, 2023	0.275 CNY	May 10, 2023	May 11, 2023
May 12, 2022	0.12286 CNY	May 11, 2022	May 12, 2022

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* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts

Data Source: S&P Global Market Intelligence Last updated: Jun 9, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every year for this company.

Update frequency:

Yearly

Last checked:

Sep 10, 2026

Data Sources Report a data error

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