China Chippacking Technology Co.,Ltd. (SHA:688216)
29.33
-0.16 (-0.54%)
At close: Apr 17, 2026
China Chippacking Technology Company Description
China Chippacking Technology Co.,Ltd. provides integrated circuit packaging and testing services in China and internationally.
The company offers CPC, ECPC, DFN, QFN, LQFP, MSOP, DIP, QIPAI, EMSOP, SOP, tODAY, SSOP, HSOP, TO, TSSOP, ESOP, and TSOT, as well as MEMS,FC, 5G nitride automotive, and home RF devices in plastic packages, such as such as QFN/DFN, CQFN/CDFN, SOT, DIP, and PDFN packaging forms.
Its products are used in consumer electronics, information and communication, smart home, IoT, industrial automation control, and automotive electronics applications.
The company also provides power device packaging and testing, and wafer testing services. The company was founded in 2006 and is based in Dongguan, China.
China Chippacking Technology Co.,Ltd.
| Country | China |
| Founded | 2006 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 1,841 |
| CEO | Dazhong Liang |
Contact Details
Address: Qipai Building Dongguan, 523330 China | |
| Phone | 86 769 8988 6666 |
| Website | chippacking.com |
Stock Details
| Ticker Symbol | 688216 |
| Exchange | Shanghai Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | CNY |
| ISIN Number | CNE100005113 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Dazhong Liang | Chairman of the Board and GM |
| Zewei Li | Assistant GM, Chief Financial Officer and Director |
| Zhengguo Wen | Deputy GM and Board Secretary |
| Xilin Rao | Deputy General Manager |
| Jia Xian Cai | Accounting Supervisor |
| Bingchuan Yi | Core Technical Personnel |
| Yang Bao Wang | Deputy General Manager |