Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
35.57
+0.51 (1.45%)
At close: Jun 5, 2025, 2:57 PM CST
SHA:688591 Dividend Information
Dividend Yield
0.56%
Annual Dividend
0.21 CNY
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
12.65%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jul 24, 2024 | 0.07323 CNY | Jul 24, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.