Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
China · Delayed Price · Currency is CNY 36.00
+1.25 (3.60%)
Mar 27, 2026, 4:00 PM EDT
SHA:688591 Dividend Information
SHA:688591 has an annual dividend of 0.21 CNY per share, with a yield of 0.57%. The dividend is paid once per year and the last ex-dividend date was Jun 27, 2025.
Dividend Yield
0.57%
Annual Dividend
0.21 CNY
Ex-Dividend Date
Jun 27, 2025
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 27, 2025 | 0.205 CNY | Jun 27, 2025 |
| Jul 24, 2024 | 0.07323 CNY | Jul 24, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.