Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
China · Delayed Price · Currency is CNY 26.94
+0.14 (0.52%)
At close: Aug 21, 2026
SHA:688591 Dividend Information
SHA:688591 has an annual dividend of 0.27 CNY per share, with a yield of 0.93%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
0.93%
Annual Dividend
0.27 CNY
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
48.55%
Dividend Growth(1Y)
29.76%
* Dividend amounts are adjusted for stock splits when applicable.