Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
China · Delayed Price · Currency is CNY 30.50
-0.61 (-1.96%)
At close: Sep 30, 2026
SHA:688591 Dividend Information
SHA:688591 has an annual dividend of 0.27 CNY per share, with a yield of 0.87%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
0.87%
Annual Dividend
0.27 CNY
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
50.82%
Dividend Growth(1Y)
29.76%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.