Telink Semiconductor(Shanghai)Co.,Ltd. (SHA:688591)
China · Delayed Price · Currency is CNY 35.21
+1.69 (5.04%)
At close: Jun 18, 2026
SHA:688591 Dividend Information
SHA:688591 has an annual dividend of 0.27 CNY per share, with a yield of 0.76%. The dividend is paid once per year and the last ex-dividend date was Jun 17, 2026.
Dividend Yield
0.76%
Annual Dividend
0.27 CNY
Ex-Dividend Date
Jun 17, 2026
Payout Frequency
Annual
Payout Ratio
48.55%
Dividend Growth(1Y)
29.76%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 17, 2026 | 0.266 CNY | Jun 17, 2026 |
| Jun 27, 2025 | 0.205 CNY | Jun 27, 2025 |
| Jul 24, 2024 | 0.07323 CNY | Jul 24, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.