Supcon Technology Co.,Ltd (SHA:688777)
China
· Delayed Price · Currency is CNY 45.75
+0.36 (0.79%)
Jul 11, 2025, 2:45 PM CST
Supcon Technology Co.,Ltd Dividend Information
Supcon Technology Co.,Ltd has an annual dividend of 0.71 CNY per share, with a yield of 1.56%. The dividend is paid once per year and the last ex-dividend date was May 30, 2025.
Dividend Yield
1.56%
Annual Dividend
0.71 CNY
Ex-Dividend Date
May 30, 2025
Payout Frequency
Annual
Payout Ratio
51.99%
Dividend Growth(1Y)
1.43%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 30, 2025 | 0.710 CNY | May 30, 2025 |
| May 30, 2024 | 0.700 CNY | May 30, 2024 |
| Jun 26, 2023 | 0.750 CNY | Jun 26, 2023 |
| Jun 14, 2022 | 0.24828 CNY | Jun 14, 2022 |
| Jun 18, 2021 | 0.1783 CNY | Jun 18, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.