Supcon Technology Co.,Ltd (SHA:688777)
China flag China · Delayed Price · Currency is CNY
45.75
+0.36 (0.79%)
Jul 11, 2025, 2:45 PM CST

Supcon Technology Co.,Ltd Dividend Information

Supcon Technology Co.,Ltd has an annual dividend of 0.71 CNY per share, with a yield of 1.56%. The dividend is paid once per year and the last ex-dividend date was May 30, 2025.

Dividend Yield
1.56%
Annual Dividend
0.71 CNY
Ex-Dividend Date
May 30, 2025
Payout Frequency
Annual
Payout Ratio
51.99%
Dividend Growth
1.43%

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 30, 2025 0.710 CNY May 29, 2025 May 30, 2025
May 30, 2024 0.700 CNY May 29, 2024 May 30, 2024
Jun 26, 2023 0.750 CNY Jun 21, 2023 Jun 26, 2023
Jun 14, 2022 0.24828 CNY Jun 13, 2022 Jun 14, 2022
Jun 18, 2021 0.1783 CNY Jun 17, 2021 Jun 18, 2021
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts