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SUPCON Technology Co., Ltd. (SHA: 688777)
China flag China · Delayed Price · Currency is CNY
49.13
-0.85 (-1.70%)
Nov 21, 2024, 3:00 PM CST

SUPCON Technology Dividend Information

Dividend Yield
1.49%
Annual Dividend
0.70 CNY
Ex-Dividend Date
n/a
Payout Frequency
Annual
Payout Ratio
50.36%
Dividend Growth
-6.67%

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 30, 20240.700 CNYMay 29, 2024May 30, 2024
Jun 26, 20230.750 CNYJun 21, 2023Jun 26, 2023
Jun 14, 20220.24828 CNYJun 13, 2022Jun 14, 2022
Jun 18, 20210.1783 CNYJun 17, 2021Jun 18, 2021
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts