Supcon Technology Co.,Ltd (SHA:688777)
China
· Delayed Price · Currency is CNY 48.36
+0.08 (0.17%)
Apr 22, 2025, 1:45 PM CST
Supcon Technology Co.,Ltd Dividend Information
Supcon Technology Co.,Ltd has an annual dividend of 0.71 CNY per share, with a yield of 1.49%. The dividend is paid once per year and the last ex-dividend date was May 30, 2024.
Dividend Yield
1.49%
Annual Dividend
0.71 CNY
Ex-Dividend Date
May 30, 2024
Payout Frequency
Annual
Payout Ratio
50.87%
Dividend Growth(1Y)
-6.67%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 30, 2024 | 0.700 CNY | May 30, 2024 |
| Jun 26, 2023 | 0.750 CNY | Jun 26, 2023 |
| Jun 14, 2022 | 0.24828 CNY | Jun 14, 2022 |
| Jun 18, 2021 | 0.1783 CNY | Jun 18, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.