SUPCON Technology Co., Ltd. (SHA: 688777)
China
· Delayed Price · Currency is CNY 53.91
-0.26 (-0.48%)
Nov 13, 2024, 3:00 PM CST
SUPCON Technology Dividend Information
SUPCON Technology has an annual dividend of 0.70 CNY per share, with a yield of 1.29%. The dividend is paid once per year and the last ex-dividend date was May 30, 2024.
Dividend Yield
1.29%
Annual Dividend
0.70 CNY
Ex-Dividend Date
May 30, 2024
Payout Frequency
Annual
Payout Ratio
50.36%
Dividend Growth(1Y)
-6.67%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 30, 2024 | 0.700 CNY | May 30, 2024 |
| Jun 26, 2023 | 0.750 CNY | Jun 26, 2023 |
| Jun 14, 2022 | 0.24828 CNY | Jun 14, 2022 |
| Jun 18, 2021 | 0.1783 CNY | Jun 18, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.