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Supcon Technology Co.,Ltd (SHA:688777)
China flag China · Delayed Price · Currency is CNY
83.99
-2.16 (-2.51%)
Sep 11, 2026, 3:00 PM CST

Supcon Technology Co.,Ltd Dividend Information

Supcon Technology Co.,Ltd has an annual dividend of 0.20 CNY per share, with a yield of 0.22%. The dividend is paid once per year and the last ex-dividend date was Jun 8, 2026.

Dividend Yield
0.22%
Annual Dividend
0.20 CNY
Ex-Dividend Date
Jun 8, 2026
Payout Frequency
Annual
Payout Ratio
99.77%
Dividend Growth
-60.56%

Dividend History

Ex-Div Date AmountRecord DatePay Date
Jun 8, 20260.280 CNYJun 5, 2026Jun 8, 2026
May 30, 20250.710 CNYMay 29, 2025May 30, 2025
May 30, 20240.700 CNYMay 29, 2024May 30, 2024
Jun 26, 20230.750 CNYJun 21, 2023Jun 26, 2023
Jun 14, 20220.24828 CNYJun 13, 2022Jun 14, 2022
Jun 18, 20210.1783 CNYJun 17, 2021Jun 18, 2021
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts