SJ Semiconductor Company Description
SJ Semiconductor Corporation operates as an integrated circuit wafer-level advanced packaging and testing company in China and internationally.
It focuses on the mid-stage silicon wafer processing and back-end advanced packaging segments of the integrated circuit advanced packaging and testing industry.
It provides middle-end-of-line manufacturing and testing services, as well as develops advanced 3D Multi-Die integration technology and solutions.
The company offers integrated circuit chips. Its products include bumping include copper pillar bump, copper pillar micro bump, copper-nickel-gold micro bumps, tin silver bumps, and ball implant bump; wafer testing; multi-chip integrated packaging.
It provides mid-section bump, wafer testing, wafer-level chip packaging, and research and development services.
The company was founded in 2014 and is based in Jiangyin, China.
| Country | China |
| Founded | 2014 |
| Industry | Electronic Components, not elsewhere classified |
| Employees | 5,968 |
| CEO | Dong Cui |
Contact Details
Address: No. 9 Dongsheng West Road Jiangyin, 214437 China | |
| Phone | 86 510 8697 5899 |
| Website | sjsemi.com |
Stock Details
| Ticker Symbol | 688820 |
| Exchange | Shanghai Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | CNY |
| SIC Code | 3679 |
Key Executives
| Name | Position |
|---|---|
| Dong Cui | Chief Executive Officer |
| Yan Zhou | Head of Investor Relations |