Senba Sensing Technology Dividend Information

Dividend Yield

1.58%

Annual Dividend

0.20 CNY

Ex-Dividend Date

n/a

Payout Frequency

n/a

Payout Ratio

45.17%

Dividend Growth

170.00%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
May 26, 2025	0.100 CNY	May 23, 2025	May 26, 2025
Sep 24, 2024	0.035 CNY	Sep 23, 2024	Sep 24, 2024
Jun 14, 2024	0.050 CNY	Jun 13, 2024	Jun 14, 2024
May 26, 2022	0.166 CNY	May 25, 2022	May 26, 2022
Jun 8, 2021	0.33333 CNY	Jun 7, 2021	Jun 8, 2021

* Dividend amounts are adjusted for stock splits when applicable.