Lepu Medical Technology (Beijing) Co., Ltd. (SWX:LEPU)
18.00
0.00 (0.00%)
Last updated: Aug 21, 2026, 9:00 AM CET
SWX:LEPU Dividend Information
SWX:LEPU has an annual dividend of 1.63 CNY per share, with a yield of 1.34%. The dividend is paid every six months and the next ex-dividend date is Sep 22, 2026.
Dividend Yield
1.34%
Annual Dividend
1.63 CNY
Ex-Dividend Date
Sep 22, 2026
Payout Frequency
Semi-Annual
Payout Ratio
109.23%
Dividend Growth(1Y)
9.59%
Dividend History
* Amounts are shown in the stock exchange currency (CHF) for convenience.