Lepu Medical Technology (Beijing) Co., Ltd. (SWX:LEPU)
18.00
0.00 (0.00%)
At close: Jul 14, 2026
SWX:LEPU Dividend Information
SWX:LEPU has an annual dividend of 0.82 CNY per share, with a yield of 0.66%. The dividend is paid once per year and the last ex-dividend date was Jun 24, 2026.
Dividend Yield
0.66%
Annual Dividend
0.82 CNY
Ex-Dividend Date
Jun 24, 2026
Payout Frequency
Annual
Payout Ratio
94.38%
Dividend Growth(1Y)
-41.00%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 24, 2026 | 0.81577 CNY | Jun 26, 2026 |
| Sep 22, 2025 | 0.81351 CNY | Sep 24, 2025 |
| Jun 20, 2025 | 0.67414 CNY | Jun 24, 2025 |
| Sep 20, 2024 | 0.7085 CNY | Sep 24, 2024 |
| Jun 30, 2023 | 1.70512 CNY | Jul 4, 2023 |
* Amounts are shown in the stock exchange currency (CHF) for convenience.