Lepu Medical Technology (Beijing) Co., Ltd. (SWX:LEPU)
18.00
0.00 (0.00%)
At close: Oct 1, 2026
SWX:LEPU Dividend Information
SWX:LEPU has an annual dividend of 2.44 CNY per share, with a yield of 1.94%. The dividend is paid every three months and the next ex-dividend date is Oct 19, 2026.
Dividend Yield
1.94%
Annual Dividend
2.44 CNY
Ex-Dividend Date
Oct 19, 2026
Payout Frequency
Quarterly
Payout Ratio
109.23%
Dividend Growth(1Y)
64.34%
Dividend History
* Amounts are shown in the stock exchange currency (CHF) for convenience.