Supcon Technology Co.,Ltd (SWX:SUPCON)

SWX:SUPCON Dividend Information

Supcon Technology Co.,Ltd has an annual dividend of 0.56 CNY per share, with a yield of 0.44%. The dividend is paid once per year and the last ex-dividend date was Jun 4, 2026.

• Dividend Yield: 0.44%
• Annual Dividend: 0.56 CNY
• Ex-Dividend Date: Jun 4, 2026
• Payout Frequency: Annual
• Payout Ratio: 145.97%
• Dividend Growth: -60.51%

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 4, 2026	0.56073 CNY	-	Jun 15, 2026
May 28, 2025	1.41992 CNY	-	Jun 6, 2025
May 30, 2024	1.39741 CNY	-	Jun 6, 2024
Jun 26, 2023	1.06301 CNY	Jun 21, 2023	Jul 3, 2023

* Amounts are shown in the stock exchange currency (CHF) for convenience.

Dividend Charts

Data Source: S&P Global Market Intelligence Last updated: Jun 4, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every year for this company.

Update frequency:

Yearly

Last checked:

Aug 21, 2026

Data Sources Report a data error

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