Supcon Technology Co.,Ltd (SWX:SUPCON)
Switzerland · Delayed Price · Currency is CHF · Price in USD 18.70
0.00 (0.00%)
At close: Jul 13, 2026
SWX:SUPCON Dividend Information
Supcon Technology Co.,Ltd has an annual dividend of 0.56 CNY per share, with a yield of 0.44%. The dividend is paid once per year and the last ex-dividend date was Jun 4, 2026.
Dividend Yield
0.44%
Annual Dividend
0.56 CNY
Ex-Dividend Date
Jun 4, 2026
Payout Frequency
Annual
Payout Ratio
145.97%
Dividend Growth(1Y)
-60.52%
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 4, 2026 | 0.56051 CNY | Jun 15, 2026 |
| May 28, 2025 | 1.41982 CNY | Jun 6, 2025 |
| May 30, 2024 | 1.39855 CNY | Jun 6, 2024 |
| Jun 26, 2023 | 1.06376 CNY | Jul 3, 2023 |
* Amounts are shown in the stock exchange currency (CHF) for convenience.