Winbond Electronics Corporation (TPE:2344)

Market Cap	798.75B +1,041.5%
Revenue (ttm)	107.67B +32.1%
Net Income	15.17B
EPS	3.37
Shares Out	4.50B
PE Ratio	52.66
Forward PE	7.00
Dividend	0.50 (0.27%)
Ex-Dividend Date	Mar 27, 2026

Volume	100,387,411
Open	188.00
Previous Close	184.50
Day's Range	177.50 - 193.00
52-Week Range	16.50 - 189.50
Beta	1.60
Analysts	Buy
Price Target	173.00 (-2.54%)
Earnings Date	Aug 3, 2026

About Winbond Electronics

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides sp...

• Industry: Semiconductors
• Sector: Technology
• Founded: 1987
• Employees: 4,899
• Stock Exchange: Taiwan Stock Exchange
• Ticker Symbol: 2344

Financial Performance

In 2025, Winbond Electronics's revenue was 89.41 billion, an increase of 9.55% compared to the previous year's 81.61 billion. Earnings were 3.96 billion, an increase of 559.22%.