Winbond Electronics Corporation (TPE:2344)

Market Cap	413.10B +403.0%
Revenue (ttm)	89.41B +9.6%
Net Income	3.96B +559.2%
EPS	0.88 +529.8%
Shares Out	4.50B
PE Ratio	104.32
Forward PE	5.66
Dividend	0.50 (0.54%)
Ex-Dividend Date	Mar 27, 2026

Volume	183,118,202
Average Volume	197,885,630
Open	96.00
Previous Close	93.10
Day's Range	91.80 - 97.60
52-Week Range	13.60 - 136.00
Beta	1.88
RSI	39.61
Earnings Date	May 4, 2026

About Winbond Electronics

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides sp...

• Industry: Semiconductors
• Sector: Technology
• Founded: 1987
• Employees: 4,899
• Stock Exchange: Taiwan Stock Exchange
• Ticker Symbol: 2344

Financial Performance

In 2025, Winbond Electronics's revenue was 89.41 billion, an increase of 9.55% compared to the previous year's 81.61 billion. Earnings were 3.96 billion, an increase of 559.22%.