Senshu Ikeda Holdings, Inc. (TYO:8714)
863.00
+10.00 (1.17%)
Jan 23, 2026, 3:30 PM JST
Senshu Ikeda Holdings Dividend Information
Senshu Ikeda Holdings has an annual dividend of 21.00 JPY per share, with a yield of 2.46%. The dividend is paid every six months and the next ex-dividend date is Mar 30, 2026.
Dividend Yield
2.46%
Annual Dividend
21.00 JPY
Ex-Dividend Date
Mar 30, 2026
Payout Frequency
Semi-Annual
Payout Ratio
32.15%
Dividend Growth(1Y)
35.48%
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Mar 30, 2026 | 10.500 JPY | Jun 26, 2026 |
| Sep 29, 2025 | 10.500 JPY | Dec 8, 2025 |
| Mar 28, 2025 | 8.000 JPY | Jun 26, 2025 |
| Sep 27, 2024 | 7.500 JPY | Nov 29, 2024 |
| Mar 28, 2024 | 6.250 JPY | Jun 27, 2024 |
| Sep 28, 2023 | 6.250 JPY | Dec 1, 2023 |
| Mar 30, 2023 | 5.000 JPY | Jun 28, 2023 |
| Sep 29, 2022 | 5.000 JPY | Dec 1, 2022 |
| Mar 30, 2022 | 6.250 JPY | Jun 29, 2022 |
| Sep 29, 2021 | 3.750 JPY | Dec 1, 2021 |
| Mar 30, 2021 | 3.750 JPY | Jun 24, 2021 |
* Dividend amounts are adjusted for stock splits when applicable.