Taiwan Semiconductor Manufacturing Company Limited (VIE:TSFA)
376.00
+4.00 (1.08%)
At close: Sep 18, 2026
VIE:TSFA Dividend Information
VIE:TSFA has an annual dividend of €2.79 per share, with a yield of 0.74%. The dividend is paid every three months and the next ex-dividend date is Dec 10, 2026.
Dividend Yield
0.74%
Annual Dividend
€2.79
Ex-Dividend Date
Dec 10, 2026
Payout Frequency
Quarterly
Payout Ratio
23.98%
Dividend Growth(1Y)
31.86%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.