Taiwan Semiconductor Manufacturing Company Limited (VIE:TSFA)
416.50
-6.00 (-1.42%)
At close: Oct 8, 2026
VIE:TSFA Dividend Information
VIE:TSFA has an annual dividend of €2.80 per share, with a yield of 0.67%. The dividend is paid every three months and the next ex-dividend date is Dec 10, 2026.
Dividend Yield
0.67%
Annual Dividend
€2.80
Ex-Dividend Date
Dec 10, 2026
Payout Frequency
Quarterly
Payout Ratio
119.05%
Dividend Growth(1Y)
32.16%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.