Taiwan Semiconductor Manufacturing Company Limited (VIE:TSFA)
367.00
+2.50 (0.69%)
Last updated: Aug 28, 2026, 2:13 PM CET
VIE:TSFA Dividend Information
VIE:TSFA has an annual dividend of €2.78 per share, with a yield of 0.76%. The dividend is paid every three months and the next ex-dividend date is Dec 10, 2026.
Dividend Yield
0.76%
Annual Dividend
€2.78
Ex-Dividend Date
Dec 10, 2026
Payout Frequency
Quarterly
Payout Ratio
23.98%
Dividend Growth(1Y)
31.02%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.