Company Description
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific.
It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage.
The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate.
In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives.
Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services.
It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries.
The company was founded in 1968 and is headquartered in Tempe, Arizona.
| Country | United States |
| Founded | 1968 |
| IPO Date | Apr 29, 1998 |
| Industry | Semiconductor Equipment & Materials |
| Sector | Technology |
| Employees | 28,700 |
| CEO | Guillaume Marie Rutten |
Contact Details
Address: 2045 East Innovation Circle Tempe, Arizona 85284 United States | |
| Phone | 480 821 5000 |
| Website | amkor.com |
Stock Details
| Ticker Symbol | AMKR |
| Exchange | NASDAQ |
| Fiscal Year | January - December |
| Reporting Currency | USD |
| CIK Code | 0001047127 |
| CUSIP Number | 031652100 |
| ISIN Number | US0316521006 |
| Employer ID | 23-1722724 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Giel Rutten | President, Chief Executive Officer and Director |
| Susan Y. Kim | Executive Chairman |
| Megan Faust CPA | Executive Vice President, Chief Financial Officer and Treasurer |
| Mark N. Rogers J.D. | Executive Vice President, General Counsel and Corporate Secretary |
| Farshad Haghighi | Executive Vice President and Chief Sales Officer |
| Kevin Engel | Executive Vice President of Business Units |
| Jennifer Jue | Vice President of Investor Relations and Finance |
| JinAn Lee | Executive Vice President of Worldwide Manufacturing |
Latest SEC Filings
| Date | Type | Title |
|---|---|---|
| Dec 16, 2024 | 8-K | Current Report |
| Oct 29, 2024 | 10-Q | Quarterly Report |
| Oct 28, 2024 | 8-K | Current Report |
| Oct 15, 2024 | 144 | Filing |
| Oct 4, 2024 | SC 13D/A | [Amend] General statement of acquisition of beneficial ownership |
| Sep 18, 2024 | 8-K | Current Report |
| Sep 16, 2024 | 144 | Filing |
| Aug 27, 2024 | 144 | Filing |
| Aug 15, 2024 | 144 | Filing |
| Aug 14, 2024 | 144 | Filing |