Company Description
ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People’s Republic of China, Singapore, and internationally.
The company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages.
The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices.
In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology.
Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment.
Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics.
The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.
| Country | Taiwan |
| Founded | 1997 |
| Industry | Semiconductors |
| Sector | Technology |
| Employees | 5,688 |
| CEO | Shih-Jye Cheng |
Contact Details
Address: No.1, Yanfa 1st Road, Hsinchu Science Park Hsinchu City Taiwan | |
| Phone | 886 3 577 0055 |
| Website | chipmos.com |
Stock Details
| Ticker Symbol | IMOS |
| Exchange | NASDAQ |
| Fiscal Year | January - December |
| Reporting Currency | TWD |
| CIK Code | 0001123134 |
| CUSIP Number | 16965P103 |
| ISIN Number | US16965P2020 |
| SIC Code | 3674 |
Key Executives
| Name | Position |
|---|---|
| Shih-Jye Cheng | Chairman, Chief Executive Officer and President |
| Silvia Su | Chief Corporate Governance Officer, Vice President of Finance and Accounting Management Center and Director |
| Jesse Huang | Senior Vice President of Strategy and Investor Relations |
| D. Y. Tsai | Executive Vice President and Head of Business Management Center |
| Vincent Hsu | Executive Vice President |
| Guang Hui Chen | Deputy General Manager |
| Dr. G. S. Shen | Deputy Director of Strategy and Investor Relations |
Latest SEC Filings
| Date | Type | Title |
|---|---|---|
| Mar 14, 2025 | 6-K | Report of foreign issuer |
| Mar 13, 2025 | 6-K | Report of foreign issuer |
| Mar 11, 2025 | 6-K | Report of foreign issuer |
| Mar 10, 2025 | 6-K | Report of foreign issuer |
| Feb 25, 2025 | 6-K | Report of foreign issuer |
| Feb 25, 2025 | 6-K | Report of foreign issuer |
| Feb 25, 2025 | 6-K | Report of foreign issuer |
| Feb 18, 2025 | 6-K | Report of foreign issuer |
| Feb 11, 2025 | 6-K | Report of foreign issuer |
| Feb 10, 2025 | 6-K | Report of foreign issuer |