Company Description
KLA Corporation, together with its subsidiaries, engages in the design, manufacture, and marketing of process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide.
It operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection.
The company offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems that are used to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk.
It also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry.
In addition, the company offers direct imaging, inspection, optical shaping, inkjet and additive printing, UV laser drilling, and computer-aided manufacturing and engineering solutions for the PCB market; inspection and electrical testing systems to identify and classify defects, as well as systems to repair defects for the display market; and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets.
The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019.
KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
Country | United States |
Founded | 1975 |
Industry | Semiconductor Equipment & Materials |
Sector | Technology |
Employees | 15,230 |
CEO | Richard Wallace |
Contact Details
Address: One Technology Drive Milpitas, California 95035 United States | |
Phone | 408 875 3000 |
Website | kla.com |
Stock Details
Ticker Symbol | KLAC |
Exchange | NASDAQ |
Fiscal Year | July - June |
Reporting Currency | USD |
CIK Code | 0000319201 |
CUSIP Number | 482480100 |
ISIN Number | US4824801009 |
Employer ID | 04-2564110 |
SIC Code | 3827 |
Key Executives
Name | Position |
---|---|
Richard P. Wallace | President, Chief Executive Officer and Executive Director |
Bren D. Higgins | Executive Vice President and Chief Financial Officer |
Ahmad A. Khan | President of Semiconductor Process Control, Electronics, Packaging Components, and KLA Instruments |
Brian W. Lorig | Executive Vice President of Global Support and Services |
Oreste Donzella | Executive Vice President and Chief Strategy Officer |
Virendra A. Kirloskar | Senior Vice President and Chief Accounting Officer |
Dr. Ben Bin-Ming Tsai | Chief Technology Officer and Executive Vice President of Corporate Alliances |
Kevin M. Kessel C.F.A. | Vice President of Investor Relations |
Mary Beth Wilkinson | Executive Vice President, Chief Legal Officer and Corporate Secretary |
Randi Polanich | Senior Vice President and Chief Communications Officer |
Latest SEC Filings
Date | Type | Title |
---|---|---|
Nov 15, 2024 | 8-K | Current Report |
Nov 12, 2024 | 144 | Filing |
Nov 8, 2024 | 8-K | Current Report |
Nov 7, 2024 | S-8 | Securities to be offered to employees in employee benefit plans |
Oct 31, 2024 | 10-Q | Quarterly Report |
Oct 30, 2024 | 8-K | Current Report |
Oct 15, 2024 | 144 | Filing |
Oct 4, 2024 | SC 13G/A | [Amend] Statement of acquisition of beneficial ownership by individuals |
Sep 24, 2024 | ARS | Filing |
Sep 24, 2024 | DEFA14A | Additional definitive proxy soliciting materials and Rule 14(a)(12) material |