BE Semiconductor Industries N.V. (AMS:BESI)
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Earnings Call: Q1 2017

Apr 25, 2017

Speaker 1

The conference is now being recorded. Good morning, good afternoon, ladies and gentlemen, and welcome to Besi's quarterly conference call and audio webcast to discuss the company's 2017 First Quarter Results. The audio webcast is available on Besy's website at www.basy.com. Joining us today are Mr. Richard Blickman, Chief Executive Officer and Mr.

Courten Hennep, Senior Vice President, Finance. At this time, all participants are in a listen only mode. Later, we will conduct a question and answer session and instructions will follow at that time. As a reminder, ladies and gentlemen, this conference is being recorded and cannot be reproduced in whole or in part without written permission from the company. I would now like to hand the call over to Mr.

Richard Blickman. Go ahead please, sir.

Speaker 2

Thank you. Thank you all for joining us today. I will begin by making a few comments in connection with the press release we issued earlier today and then take your questions. I would like to remind that some of the comments made during this call and some of the answers in response to your questions by management may contain forward looking statements. Such statements may involve uncertainties and risks as described in the earnings release and other reports filed with the AFM.

For today's call, we'd like to review the key highlights of our Q1 ended March 31, 2017, and also spend time updating you on the market, our strategy and the outlook. First, some overall thoughts on the past quarter. In Q1 this year, we realized strong revenue growth in line with guidance. Operating profits that exceeded expectations and a 162.4 percent order increase versus the Q4 last year, reaching €239,800,000 Also, our first quarter results position Besi for a strong first half twenty seventeen financials performance. The substantial order growth in the Q1 was due to a variety of factors, the most prominent of which was a significant expansion by IDMs and their respective supply chains of die bonding capacity for next generation mobile devices.

Our leading edge portfolio of multimodal epoxy and flip chip tibonding systems are uniquely positioned to capitalize on this capacity build by first movers in the industry who require the most demanding specifications in terms of form factor, pitch, complexity and production output. In addition, Besi also realized broad based order growth for its advanced packaging systems, addressing automotive and high end cloud server applications. We also experienced increased demand by Chinese subcontractors for smartphone and mainstream electronics applications. Order growth in these areas reflects a continuation of trends from 2016. In the Q1, revenue increased by 18.4% versus Q4 last year and 39.5% versus the first quarter last year due to the benefits of a more favorable industry environment that started at the end of the 4th quarter as well as increased demand for smartphone applications.

Revenue growth combined with continued improvement in gross margins to 55 0.7% and tight control of baseline operating expenses enabled Besi to generate net income of €24,300,000 in the Q1 and a net margin of 22%. Net income levels more than tripled versus the Q1 last year, while net margins more than doubled versus the year ago period, reflecting the enhanced profit potential of our business model. With that, I'll turn the presentation over to Corit Anapen.

Speaker 3

Okay. Thank you, Richard. Our strong Q1 2017 revenue growth was within Besi's prior guidance of 15% to 20% as compared to the previous quarter. Perhaps the big story, as Richard mentioned, was the substantial growth in our order book, both sequentially and year over year. Q1 2017 order growth came mostly from IDMs with sequential growth of €145,000,000 or 2 84%, while subcontractor orders increased by €3,000,000 or 7.5%.

As you know, our mix between IDMs and subcons is typically fifty-fifty or sixty-forty. So we consider this as more one off event than a structural shift in our order mix. Besi's gross margin rose up to 55.7% in Q1 2017, an increase of 2.5 points versus Q4 2016 and 6.5 points versus Q1 2016. This quarter's gross margin exceeded prior guidance of 52% to 54%. We continue to operate at the high end of our target gross margin of 50% to 55%, given our leading market position in advanced packaging applications the current trends in the near term, incremental efficiencies from our Asian operations and favorable foreign currency trends.

In Q1 2017, improved gross margins were principally due to increased material cost efficiencies, particularly in the year over year comparison and ForEx benefits related primarily to a decrease in the value of the Malaysian ringgit versus the euro. In addition, Besi benefited in the year over year comparison from an increase in the value of the U. S. Dollar versus the euro. Besi's Q1 2017 operating expenses increased by €700,000 or 2.3% versus Q4 2016.

This was less than prior guidance of an increase of 5% to 10%. The increase was due primarily to higher bonus and benefit compensation associated with our 2016 financial performance, partially offset by lower advisory costs. As per the chart presented, you can see that baseline OpEx is growing very slowly versus our top line development given ongoing cost control efforts as well as the benefits of continued functional SG and A transfers to Asia from Europe. Of note, the headcount at March 31 this year increased by 12.8% versus end of last year, principally as a result of higher Asian temporary production personnel in support of the large Q1 2017 order increase and expanded Asian operations. The full impact of this headcount increase will be seen in our Q2 2017 OpEx guidance along with increased revenue based variable expenses.

Besi's net income reached €24,300,000 in Q1 2017, an increase of €7,600,000 or 45.5 percent versus Q4 'sixteen and €16,300,000 or 204% versus Q1 'sixteen. Similarly, net margins increased to 22 percent in Q1 'seventeen versus 18% in previous quarter and 10.1% in Q1 'sixteen in what traditionally is a weak quarter. Net income growth was principally due to our strong revenue development, continued gross margin improvement and operating leverage in our business model from ongoing cost control efforts. Effective tax rate varied only slightly in each of the comparable periods. Our liquidity position continued to improve with net cash rising to €175,700,000 at the end of Q1 'seventeen, an increase of €7,600,000 or 4.5 percent versus Q4 'sixteen and €27,300,000 or 18.4 percent versus Q1 2016.

Growth occurred despite €18,000,000 invested in working capital to finance the large order ramp during the quarter and €7,500,000 of cash used for share repurchases. Remember that we intend to pay out approximately $65,000,000 for dividends in Q2 2017, which will reduce net cash balances at quarter end from current levels. Regular share repurchase activity continued in Q1 'seventeen with approximately 167 ordinary shares bought at an average price of €35.03 per share. Cumulatively as of March 31, 2017, a total of approximately 293,000 shares have been purchased at an average price of €33.42 per share for a total of €9,800,000 And with that, I'll turn the presentation back over to Richard.

Speaker 2

Thanks, Cor. Now I'd like to update you on our strategy, the market and guidance for the Q2. Looking forward, there still remains much unrealized potential to increase Besi's market position and profitability in the years ahead. Last quarter, we laid out our updated strategic agenda, which we're pursuing actively. Currently, our principal focus is further scaling our Asian operations and supply chain to support the current order upturn and

Speaker 1

ensure on time customer deliveries

Speaker 2

this year. We have sufficient capacity to handle this ramp partly due to the efforts of the past 2 years to qualify additional Asian vendors and increase the production capabilities of our Malaysian and particularly Chinese operations. Now a couple of words about the market and our Q2 guidance. We witnessed the favorable upward turn of the assembly equipment market in late Q4 last year, which has continued into the Q1 of this year and to date in the Q2. The underlying baseline for semiconductors remains positive with Gartner recently upping its semiconductor growth forecast from 7.5% to 12.5% this year.

VLSI has not revised its 2017 2018 forecast for the assembly equipment market yet from the start of the year. They initially forecast growth of 9% in 2017, which could be at the low end of estimates given the first half of twenty seventeen industry activity. There are many drivers for our market at present. Such drivers include anticipated new smartphone and electronic device introductions, the continued shift to smaller geometries and new applications for semiconductors in cars and also the digital society in general. In addition, we will also benefit from the ongoing move to the cloud and the rapid emergence of a Chinese semiconductor industry.

Such trends provide strong underpinnings for growth in the new advanced packaging solutions and plays to Besi's technology strength and market leading position. Besi's 2nd quarter this year guidance calls for revenue growth between 40% 50% versus the Q1. Gross margins is expected to be in the range of 54% to 56% and OpEx should grow by about 10% to 15% consistent with recent headcount growth and higher anticipated sales levels. Given our improved 2017 business outlook and the midpoint of the Q2 'seventeen guidance, we forecasted operating income for the 1st 6 months will exceed the full year of 2016 leverage. This ends my prepared remarks.

I would now like to open the call for some questions. Operator?

Speaker 1

Thank you, sir. Our first question is from Mr. Peter Olsson of Kepler Cheuvreux. Go ahead, please. Your line is open.

Speaker 4

Good afternoon, gentlemen. Clearly, very strong numbers looking at the order intake on the IDM side. Just trying to understand what's driving this demand. You're referring to next generation mobile devices. Are there specific applications or features in these devices that are driving the demand like sensors?

Or is it pretty broad based for different type of chips going into these devices?

Speaker 2

Well, it's not only about smartphones then. It is, as we indicated, on all 3 major markets, the I'm server market, automotive also very strong and also the smartphone arena. There are certainly new applications included with tighter specs and more challenges, which have been developed by many customers over the past several years and should be implemented in next generation product, whether that is sensors or whether that has to do with other features, it's a very broad based increase. And clearly, IDMs are always leading the way and subcontractors tend to follow. But also with the consolidation in the industry, more and more transparency is available through direct ordering of IDMs through the subcons and installing the capacity either at the IDMs, but mostly at subcontractors.

So that is the current picture.

Speaker 4

Okay. And when you say it's broad based, you also mean within the mobile device market, meaning you see it in various supply chains?

Speaker 2

Yes. Yes, yes. And as we mentioned in the call in February, Besi is more and more strongly represented in the Chinese smartphone world on top of our many years strength in the bleeding end devices for many years. So a very broad based smartphone world.

Speaker 4

Okay. And I heard you talk about advanced packaging for high end cloud server. Is that particularly TCB related? Or what kind of product should I think of?

Speaker 2

It's a combination. Still, TCB is very low in volume for the very high, high end. The mainstream you can characterize still using current, but also very advanced technologies in flip chip, but also in wirebond for that matter. So it's pushing the envelope of existing technologies and slowly using new technologies there where the existing do not are not able to fulfill the technology criteria.

Speaker 4

Okay. And maybe then final question on my side. So to what extent do you think the very strong order intake from the IDMs is sustainable?

Speaker 2

Well, as we know very well, the world is cyclical. Clearly, we are in a positive setting, as mentioned, in overall and you can read that with many of the articles on this industry and on the equipment in particular. But at the same time, there's clearly a next generation technology underway. If we take the other size, which we also mentioned, expecting 2017 2018 to be positive growth years. Whether it will continue at the pace we see we've seen in the Q1 is, of course, to be seen.

But as we mentioned, Q2 started off similarly well as Q1. So we do have already some significant visibility into Q3. So far so good.

Speaker 4

Maybe just to clarify on the visibility that you have for Q3 already. If I look at the backlog that you have going into Q2, that's higher than what you're guiding for in terms of Q2 sales. So apparently, some of that is already for the second half. Is that because that's the client wants the machine in Q3? Is that the key reason?

Or is there any indication that your lead times are lengthening?

Speaker 2

No, no. The customers typically have a program installing a certain capacity. When it's one machine, it's easy. But when it's multiple machines, the installation is typically organized over a period of time. So there are certain orders which are partly shipped in Q2 and partly shipped in Q3.

And that's always the case. But you've seen very well that the backlog going into Q2 and the revenue guidance for Q2 already gives us a very good visibility into Q3.

Speaker 4

Okay. Yes, that's clear. Thank you.

Speaker 1

Our next question is from Mr. Nigel van Putten of ING. Go ahead sir. Your line is open.

Speaker 5

Afternoon, gentlemen, and congratulations on the strong executions and the order intake. I have well, some of the questions have already been answered. Yes, first one is on the market forecast by Virecaya. You said that it's a bit conservative. But if you look around, do you think your growth in 2017 is primarily driven by the market upturn?

Or is it mostly due to market share gains?

Speaker 2

Well, it's a very interesting question. I've seen or we have seen nowhere the growth in orders forecasted by the independent market organizations like our increase. So if you analyze that, it could very well be that we are gaining market share and that will then be very significant. How conservative VLSI is, one never knows, but take last year for instance in 2016, GLSI guided into a negative year. And in the end, it ended with a growth of double digits.

So this industry is hard to predict, but the conclusion for us is we started off very well and on a very broad base.

Speaker 5

Yes, understood. And then one follow-up, Peter just asked about IDMs being a larger percentage of the order book. I think the U. S. Based IDM at the manufacturing day was quite open about its intention to focus more on packaging.

I think the major Taiwanese foundry also said it's going to spend up to €1,000,000,000 on its back end processes. Besides the cyclicality, do you see sort of a longer term trend where the historically called back end processes or equipment is becoming more important for these leading edge players?

Speaker 2

Yes. 1st of all, more and more advanced packaging is becoming the bottleneck for new product introduction for IDMs. So their focus on developing at the right point in time the advanced packaging solutions has increased in comparison to the trend over the past years, but still the volume production will be installed at many subcontractors. But the position of the IDMs in that process is more predominant than they used to be in the past, simply because it's more critical. And it will be even more critical going forward.

Speaker 5

Right. And then maybe as a quick follow-up on that is that do you think that you are particularly good well positioned because of the higher accuracy your equipment typically has to cater to this demand?

Speaker 2

Well, currently, you could draw that conclusion. We are very well positioned and very close to the winners in this industry at this moment. But that is a very tight growth to work on. Every day you have to prove your solutions being superior to that of your competitors. But it's fair to say that currently we have a very strong position.

Speaker 1

The following question is from Mr. Robert Saunders of Deutsche Bank. Go ahead sir. Your line is open.

Speaker 6

Yes, good afternoon. Thanks for taking my question. So my first question was just a clarification, which was just regarding the big Taiwan foundry. Is that that's classified under IDM under your nomenclature, I assume. I just wanted to double check that.

That was my first question.

Speaker 2

That's under IDM.

Speaker 6

Got it. Okay. And then when you think about the patent, the order patent relative to history, what do you think explains this dramatic change in order pattern relative to history? It's very rare that you get this kind of lumpiness. Is it more driven by a technology shift?

Or is it just that the stars have aligned, everyone is fully utilized and everyone needs new capacity ASAP?

Speaker 2

No, no. It is more of the first time. Clearly, our current set of products is uniquely positioned in every qualification. And that's why we have received such a strong amount of orders on a very broad base. This is not a 1 or 2 customer phenomena.

So realizing that, that should put us also in a much stronger position going forward.

Speaker 6

Got it. So we shouldn't read into this that We said

Speaker 2

it is not full.

Speaker 6

Got it. So we shouldn't read into this that somehow wafer level packaging fan out is suddenly reached an amazing cost performance threshold and is suddenly going to go gangbusters because that wasn't the perspective I got last time we chatted?

Speaker 2

No, no. It's more the contrary. It's a very important question you are posing. Yet again, this cycle is predominantly using the existing technologies and the new technologies fan out TCP are still pushed out into the next generation in volume. So it's very interesting to see that this industry is has the possibility to push those envelopes.

Speaker 6

Got it. Okay. Thanks a lot.

Speaker 1

Our next question is from Mr. Edwin de Jong of NIBC. Go ahead sir. Your line is open.

Speaker 3

Good afternoon

Speaker 2

gentlemen. A couple of questions left. Could you tell maybe a little bit about pricing developments and volume developments going into Q1, Q2 is a little bit about mix maybe? And then on the backlog, could you give an idea of how it is split in geography by geography? And then as a last question, how much way do you have to go before you really are at full capacity?

Excellent. Well, the first question, pricing and volume, You can see also in the guidance for the Q2 that pricing is still very strong of our products. It depends on several factors, of course, the competitive position, it depends on the dollar euro exchange rate. But so far, there are no changes in these trends.

Speaker 5

Excuse

Speaker 2

me? So it's mostly volume development. Yes. But under the current competitive pricing position and maybe some improvements even, because in the current situation in the industry, there is a very strong demand. So that always supports pricing of equipment.

Your second question, backlog geographies that is very much as it usually develops with Asia being a larger part than the rest of the world, so U. S. And Europe. But within Asia, is it getting more China? It's more now in China, if the percentage in China has again gone up in the Q1 compared to the Q4, and one can expect that going forward, the percentage in China is will increase further and we are well prepared for that with more and more systems we build in China in our own facility.

And then are we at full capacity? No, not yet. We are able to expand our capacity further. We have shared some models in the past and our current infrastructure is certainly able to cope with the current demand, but also further increases are possible. So key is to understand China coming on stream.

So we have shared last year, we did close to 140 systems in our China facility. This year that will be certainly close to 300. And we also expanded Malaysia. So that's not a concern at this moment. Okay, great.

And then maybe so Q2 is great. The outlook for Q3 is also still good. Q4, Do you already have any indication or idea where that could be going? No. That's too early to tell.

You can only use some statistics, but that can also surprise in different ways. We look ahead usually 1 quarter. This time we are able to look a bit further than 1 quarter, but that's it.

Speaker 4

Okay. Okay, very clear. Thanks.

Speaker 1

We have a further question from Mr. Peter Olsson of Kepler Cheuvreux. Go ahead. Your line is open. Mr.

Olsson, your line is open.

Speaker 4

Yes. I had 2 follow ups. First on the gross margin. In the second half in terms of sales, the IDM share will be pretty high. Does the share between IDMs and subcontractors affect your gross margin?

Is there a margin differential between the 2?

Speaker 2

The answer is no.

Speaker 4

Okay. That's very clear. And then just to clarify that TSMC is classified as an IDM. Is that correct? Is that what you said?

Yes. Yes, yes, yes. Okay. Because in some of your presentations, you have shown their logo as among those subcontractors. But okay, it's good to know that's then in IDMs.

Okay, thank you.

Speaker 1

We have another question from Mr. Robert Saunders of Deutsche Bank. Go ahead. Your line is open.

Speaker 6

Yes, just a follow-up question would be on Intel. They're one of the few I think it was mentioned earlier in a previous question. I mean, they're one of the few companies that develops its own packaging tech. I was just wondering if there's anything in the server or graphics or whatever area, I mean, there's been a lot of talk about, for example, HBM, that could lead to a significant change in the amount that they spend and how that and whether that could affect you in this way, Because it does seem quite unusual for them to spend so much more. And I'm just wondering if there's any technology disruption that could be there that could benefit you guys.

Thanks.

Speaker 2

Well, 1st of all to clarify, the company you mentioned is not the only one developing packaging solutions. The whole world is developing packaging solutions, all the IDMs and also the fabless companies. And as I responded to an earlier question, more and more the development of assembly solutions is key to the performance of the end product as opposed to in the years back, assembly was a capacity part of the industry and simply electronic building blocks. So there is more to this world than only that company developing on an ongoing basis new package designs and more complex 3 d solutions using different technologies. And the key is to be engaged with the broad base of the assembly packaging development companies in all the areas, whether that is the server world or the telecommunications, smartphone world or the automotive world for that matter.

There are no, let's say, at this moment significant changes. There is no significant changes. It's even more a bit the opposite, as I answered to an earlier question. It's again a generation which uses existing technology where our systems time again prove to be able to fulfill the accuracy requirements, but also with further increased speed, reduce the cost of ownership. And on top of that, the stability is superior to many of our competitors.

So it's not because of the world's change shift or however you want to call that.

Speaker 6

Got it. I mean, I just the reason I mentioned is because ASM Pacific, which is probably your closest peer, I don't think they are seeing this level of strength. And if anything, I think they're going to be they're going to see an order decline in the second So just it seems to me that they are saying that the market has peaked on orders and you guys are even more bullish than them, which is unusual. So I was just trying to get to that, but I guess there's not much you can say on that. Thanks.

Speaker 2

Okay. Thank you.

Speaker 1

We have a further question from Mr. Nigel Van Putten of ING. Go ahead. Your line is open.

Speaker 5

Hi, thanks. Yes, I have a couple of housekeeping questions. I was dropped from the line for a bit, so apologies if I make you repeat core. On the OpEx level for the second half, can you give a bit of guidance? Second question is on the interest for the quarter was a bit higher, part of that is FX.

What should we sort of assume for the quarters ahead? And then on the tax rate for the full year, could you provide a bit of guidance there as well?

Speaker 3

Okay. Well, cost level, as you can see in the guidance, we expect an increase of 10% to 15%. That goes along with the increase of revenue. As you know that a number of components of our costs are related to the volume in revenues like warranty, like some sales commissions and like some, let's say, freight cost outgoing freight cost to customers. So they will be typically the main driver behind this increase as we guided in Q2.

Financial income, basically there is the cost for the convertible. There is also what we call IFRS component in the interest. So it's not only the 2.5% cash out, it's also partly an IFRS component, which has to do with the valuation of the possibility to exchange against shares, so against equity. And part of it is ForEx that is mainly related to difference in timing of we hedge immediately, but sometimes the rates we have to use are a bit different from the banks, then it's not really loss or gain. But it shows it could show up in another line

Speaker 6

in the P and L.

Speaker 3

So that's a technicality. But going forward, the financial costs will be more or less in line with Q1, could be somewhat lower because we had somewhat more ForEx, but more or less in line to slightly lower. The overall income tax so effective tax rate, as last year Q1 is slightly higher than the other quarters as we have some more LTI costs in our Q1 traditionally. But over the year, we guided between 12% 15%. And for now, there's no reason for a change.

Speaker 1

Chairman, we have no further questions at this time. Please continue.

Speaker 2

Well, thank you all for joining this call. And if you have any further questions, you know where to reach us. Thank you. Bye bye. Bye.

Speaker 1

This concludes this conference. On behalf of Besi, thank you for attending. You can disconnect your line now.

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