Netherlands · Delayed Price · Currency is EUR BE Semiconductor Industries Earnings Call Transcripts
Fiscal Year 2026
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Q1 2026 saw revenue up 28.3% YoY and orders more than double, driven by strong AI, mobile, and photonics demand. Net income and margins improved sharply, with hybrid bonding adoption accelerating and capacity expanded to meet robust order growth.
Fiscal Year 2025
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Q4 2025 saw strong sequential growth in revenue and orders, driven by AI and data center demand, with profitability and liquidity remaining robust. Hybrid bonding adoption expanded, and 2026 guidance points to continued growth, especially in advanced packaging and AI-related segments.
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Q3 2025 saw a strong rebound in orders, especially for data center and photonic applications, despite continued weakness in mobile and automotive. Revenue and net income declined year-over-year, but Q4 is expected to see double-digit sequential growth, with advanced packaging and AI demand driving future outperformance.
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Q2 2025 saw modest sequential growth, with strong hybrid bonding and AI-related demand offsetting continued weakness in mobile and automotive. Orders and revenue are expected to rise in H2 2025, especially for advanced packaging, despite FX headwinds and soft mainstream markets.
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AI-driven demand and advanced packaging are accelerating growth, with hybrid bonding and TC Next as core technologies. Revenue targets for the next five years have been raised, supported by higher margins, increased R&D, and strong customer adoption across logic, memory, and photonics.
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Q1 2025 saw a slight revenue decline but order growth, with strong AI and hybrid bonding demand offsetting mobile and auto weakness. Gross margin and net income declined, but cash generation and capital returns remained robust. Tariff risks cloud the outlook, but long-term AI-driven growth is expected.
Fiscal Year 2024
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Q4 2024 saw revenue and orders decline due to weak mainstream and automotive demand, but full-year revenue and orders grew on strong AI-related hybrid bonding and photonics. Gross margin improved, R&D spending rose, and a solid liquidity position was maintained. AI applications drove 50% of orders in 2024.
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Q3 2024 saw strong revenue and net income growth, driven by advanced packaging for AI, while mainstream and Chinese markets remained weak. Over 100 hybrid bonding systems have been ordered, with further capacity expansion and new product generations planned for 2025. Guidance for Q4 is flat revenue with robust gross margins.
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Q2 2024 saw strong revenue and net income growth, driven by AI and advanced packaging demand, with gross margin at 65% and bookings up 64.5% year-over-year. Outlook for Q3 is stable, with continued R&D investment and a €350 million bond issued to support future growth.
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AI-driven demand is accelerating adoption of hybrid bonding and advanced packaging, with strong market share gains and broadening customer adoption across logic, memory, and photonics. Financial targets remain robust, with upgraded growth forecasts and continued high margins.