Taiwan Semiconductor Manufacturing Company Limited (BUL:TSFA)
356.50
0.00 (0.00%)
At close: Nov 10, 2026
BUL:TSFA Dividend Information
BUL:TSFA has an annual dividend of 3.54 USD per share, with a yield of 1.71%. The dividend is paid every three months and the next ex-dividend date is Dec 10, 2026.
Dividend Yield
1.71%
Annual Dividend
$3.54
Ex-Dividend Date
Dec 10, 2026
Payout Frequency
Quarterly
Payout Ratio
22.57%
Dividend Growth(1Y)
33.37%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.