Egide Company Description
Egide S.A., together with its subsidiaries, develops, manufactures, and sells hermetic package solutions for micro-electronic and optical product applications in France, EEC outside France, the United States, Canada, and internationally.
The company offers designs and manufactures packages for the thermal imaging market; window assemblies, high-precision window holders, high temperature co-fired ceramic (HTCC) feedthroughs, hermetic housing, ceramic boards, getter welding, and cold fingers for cooled IR systems; and power packages.
It also provides protection and interconnection of the opto-electroncis chips; various RF packages for various markets; RF and DC glass beads, and SMPM connector; and HTCC packages, including surface mount and lead-frame, as well as leadless packages comprising ball grid array, land grid array, quad flat no-lead and leadless chip carrier, and pin grid array, HTTC connectors, and HTCC ceramic substrates.
The company serves defense/space, telecommunications, industrial/energy, medical, opto-electronics, infra-red, sensors, RF, communications, and other markets.
Egide S.A. was incorporated in 1986 and is headquartered in Bollène, France.
| Country | France |
| Founded | 1986 |
| Industry | Electronic Components, not elsewhere classified |
| Employees | 244 |
| CEO | Ignace Dupon |
Contact Details
Address: Site Sactar-CS 20205 Bollène, 84505 France | |
| Phone | 33 4 90 30 97 11 |
| Website | egide-group.com |
Stock Details
| Ticker Symbol | EGID |
| Exchange | Frankfurt Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | EUR |
| SIC Code | 3679 |
Key Executives
| Name | Position |
|---|---|
| Ignace Dupon | Chief Executive Officer |