Chengdu SIWI Science and Technology Company Limited (HKG:1202)
1.540
+0.010 (0.65%)
Jul 6, 2026, 3:26 PM HKT
HKG:1202 Dividend Information
HKG:1202 has an annual dividend of 0.012 HKD per share, with a yield of 0.76%. The last ex-dividend date was Jun 24, 2026.
Dividend Yield
0.76%
Annual Dividend
0.012 HKD
Ex-Dividend Date
Jun 24, 2026
Payout Frequency
n/a
Payout Ratio
20.12%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 24, 2026 | 0.0115 HKD | Jul 31, 2026 |
* Dividend amounts are adjusted for stock splits when applicable.