Chengdu SIWI Science and Technology Company Limited (HKG:1202)

HKG:1202 Dividend Information

HKG:1202 has an annual dividend of 0.012 HKD per share, with a yield of 0.78%. The last ex-dividend date was Jun 24, 2026.

• Dividend Yield: 0.78%
• Annual Dividend: 0.012 HKD
• Ex-Dividend Date: Jun 24, 2026
• Payout Frequency: n/a
• Payout Ratio: 13.78%
• Dividend Growth: n/a

Dividend History

Ex-Dividend Date	Cash Amount	Record Date	Pay Date
Jun 24, 2026	0.0115 HKD	Jun 25, 2026	Jul 31, 2026

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* Dividend amounts are adjusted for stock splits when applicable.

Data Source: S&P Global Market Intelligence Last updated: Jun 24, 2026

Dividend data is provided by S&P Global Market Intelligence and updates within hours after each dividend announcement, which is every three months for this company.

Update frequency:

Quarterly

Last checked:

Sep 2, 2026

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