Morimatsu International Holdings Company Limited (HKG:2155)
6.49
-1.06 (-14.04%)
Mar 24, 2026, 4:08 PM HKT
HKG:2155 Dividend Information
HKG:2155 has an annual dividend of 0.15 HKD per share, with a yield of 1.99%. The dividend is paid once per year and the next ex-dividend date is Jul 9, 2026.
Dividend Yield
1.99%
Annual Dividend
0.15 HKD
Ex-Dividend Date
Jul 9, 2026
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 9, 2025 | 0.150 HKD | Jul 25, 2025 |
| Jul 3, 2024 | 0.100 HKD | Jul 19, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.