Morimatsu International Holdings Company Limited (HKG:2155)
9.00
+0.46 (5.39%)
May 22, 2026, 4:08 PM HKT
HKG:2155 Dividend Information
HKG:2155 has an annual dividend of 0.20 HKD per share, with a yield of 2.22%. The dividend is paid once per year and the next ex-dividend date is Jul 9, 2026.
Dividend Yield
2.22%
Annual Dividend
0.20 HKD
Ex-Dividend Date
Jul 9, 2026
Payout Frequency
Annual
Payout Ratio
28.43%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 9, 2025 | 0.150 HKD | Jul 25, 2025 |
| Jul 3, 2024 | 0.100 HKD | Jul 19, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.