Morimatsu International Holdings Company Limited (HKG:2155)
6.75
-0.27 (-3.85%)
May 4, 2026, 4:08 PM HKT
HKG:2155 Dividend Information
HKG:2155 has an annual dividend of 0.20 HKD per share, with a yield of 2.85%. The dividend is paid once per year and the next ex-dividend date is Jul 9, 2026.
Dividend Yield
2.85%
Annual Dividend
0.20 HKD
Ex-Dividend Date
Jul 9, 2026
Payout Frequency
Annual
Payout Ratio
28.43%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jul 9, 2025 | 0.150 HKD | Jul 25, 2025 |
| Jul 3, 2024 | 0.100 HKD | Jul 19, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.