TI Cloud Inc. (HKG:2167)
3.200
+0.070 (2.24%)
At close: Mar 27, 2026
TI Cloud Dividend Information
Dividend Yield
3.13%
Annual Dividend
0.10 HKD
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 5, 2025 | 0.100 HKD | Jul 3, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.