TI Cloud Inc. (HKG:2167)
4.200
+0.100 (2.44%)
Aug 19, 2026, 3:55 PM HKT
TI Cloud Dividend Information
TI Cloud has an annual dividend of 0.10 HKD per share, with a yield of 2.44%. The dividend is paid once per year and the last ex-dividend date was Jun 5, 2026.
Dividend Yield
2.44%
Annual Dividend
0.10 HKD
Ex-Dividend Date
Jun 5, 2026
Payout Frequency
Annual
Payout Ratio
26.09%
Dividend Growth(1Y)
n/a
* Dividend amounts are adjusted for stock splits when applicable.