TI Cloud Inc. (HKG:2167)
5.10
+0.18 (3.76%)
At close: Sep 9, 2026
TI Cloud Dividend Information
TI Cloud has an annual dividend of 0.10 HKD per share, with a yield of 1.94%. The dividend is paid once per year and the last ex-dividend date was Jun 5, 2026.
Dividend Yield
1.94%
Annual Dividend
0.10 HKD
Ex-Dividend Date
Jun 5, 2026
Payout Frequency
Annual
Payout Ratio
19.26%
Dividend Growth(1Y)
n/a
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.