TI Cloud Inc. (HKG:2167)
3.500
-0.070 (-1.96%)
May 8, 2026, 3:43 PM HKT
TI Cloud Dividend Information
TI Cloud has an annual dividend of 0.10 HKD per share, with a yield of 2.86%. The next ex-dividend date is Jun 5, 2026.
Dividend Yield
2.86%
Annual Dividend
0.10 HKD
Ex-Dividend Date
Jun 5, 2026
Payout Frequency
n/a
Payout Ratio
26.09%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 5, 2025 | 0.100 HKD | Jul 3, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.