TI Cloud Inc. (HKG:2167)
3.200
+0.110 (3.56%)
Jul 10, 2026, 3:44 PM HKT
TI Cloud Dividend Information
TI Cloud has an annual dividend of 0.10 HKD per share, with a yield of 3.24%. The dividend is paid once per year and the last ex-dividend date was Jun 5, 2026.
Dividend Yield
3.24%
Annual Dividend
0.10 HKD
Ex-Dividend Date
Jun 5, 2026
Payout Frequency
Annual
Payout Ratio
26.09%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| Jun 5, 2026 | 0.100 HKD | Jul 3, 2026 |
| Jun 5, 2025 | 0.100 HKD | Jul 3, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.