LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG: 2291)
Hong Kong
· Delayed Price · Currency is HKD 17.42
-0.78 (-4.29%)
Oct 10, 2024, 4:08 PM HKT
LEPU ScienTech Medical Technology (Shanghai) Dividend Information
LEPU ScienTech Medical Technology (Shanghai) has an annual dividend of 0.63 HKD per share, with a yield of 3.59%. The last ex-dividend date was May 28, 2024.
Dividend Yield
3.59%
Annual Dividend
0.63 HKD
Ex-Dividend Date
May 28, 2024
Payout Frequency
n/a
Payout Ratio
n/a
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 28, 2024 | 0.62594 HKD | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.