LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong · Delayed Price · Currency is HKD 15.85
+0.07 (0.44%)
At close: Mar 27, 2026
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.67 HKD per share, with a yield of 4.25%. The dividend is paid once per year and the last ex-dividend date was May 26, 2025.
Dividend Yield
4.25%
Annual Dividend
0.67 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
Annual
Payout Ratio
67.78%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 26, 2025 | 0.67366 HKD | Jul 31, 2025 |
| May 28, 2024 | 0.62594 HKD | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.