LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong · Delayed Price · Currency is HKD 17.11
-0.36 (-2.06%)
Jan 21, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.67 HKD per share, with a yield of 3.86%. The dividend is paid once per year and the last ex-dividend date was May 26, 2025.
Dividend Yield
3.86%
Annual Dividend
0.67 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
Annual
Payout Ratio
67.78%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 26, 2025 | 0.67366 HKD | Jul 31, 2025 |
| May 28, 2024 | 0.62594 HKD | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.