LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
19.50
-0.60 (-2.99%)
May 16, 2025, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.67 HKD per share, with a yield of 3.45%. The next ex-dividend date is May 26, 2025.
Dividend Yield
3.45%
Annual Dividend
0.67 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
n/a
Payout Ratio
79.32%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
May 28, 2024 | 0.62594 HKD | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.