LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong flag Hong Kong · Delayed Price · Currency is HKD
19.50
-0.60 (-2.99%)
May 16, 2025, 4:08 PM HKT

HKG:2291 Dividend Information

HKG:2291 has an annual dividend of 0.67 HKD per share, with a yield of 3.45%. The next ex-dividend date is May 26, 2025.

Dividend Yield
3.45%
Annual Dividend
0.67 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
n/a
Payout Ratio
79.32%
Dividend Growth
n/a

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 28, 20240.62594 HKDMay 29, 2024Jul 22, 2024
* Dividend amounts are adjusted for stock splits when applicable.