LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong flag Hong Kong · Delayed Price · Currency is HKD
22.00
-1.70 (-7.17%)
Jun 13, 2025, 4:08 PM HKT

HKG:2291 Dividend Information

HKG:2291 has an annual dividend of 0.68 HKD per share, with a yield of 2.86%. The dividend is paid once per year and the last ex-dividend date was May 26, 2025.

Dividend Yield
2.86%
Annual Dividend
0.68 HKD
Ex-Dividend Date
May 26, 2025
Payout Frequency
Annual
Payout Ratio
79.32%
Dividend Growth
n/a

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 26, 20250.67366 HKDMay 27, 2025Jul 31, 2025
May 28, 20240.62594 HKDMay 29, 2024Jul 22, 2024
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts