LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong · Delayed Price · Currency is HKD 14.68
+2.50 (20.53%)
Aug 21, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.58 HKD per share, with a yield of 4.94%. The dividend is paid once per year and the last ex-dividend date was May 27, 2026.
Dividend Yield
4.94%
Annual Dividend
0.58 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
-15.01%
* Dividend amounts are adjusted for stock splits when applicable.