LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong · Delayed Price · Currency is HKD 12.61
+0.14 (1.12%)
Oct 2, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.58 HKD per share, with a yield of 4.63%. The dividend is paid once per year and the last ex-dividend date was May 27, 2026.
Dividend Yield
4.63%
Annual Dividend
0.58 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
105.26%
Dividend Growth(1Y)
-15.01%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.