LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong · Delayed Price · Currency is HKD 11.10
-0.12 (-1.07%)
May 11, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.58 HKD per share, with a yield of 5.13%. The dividend is paid once per year and the next ex-dividend date is May 27, 2026.
Dividend Yield
5.13%
Annual Dividend
0.58 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
89.68%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 26, 2025 | 0.67366 HKD | Jul 31, 2025 |
| May 28, 2024 | 0.62594 HKD | Jul 22, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.