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LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
Hong Kong flag Hong Kong · Delayed Price · Currency is HKD
13.82
-0.24 (-1.71%)
Nov 13, 2026, 4:08 PM HKT

HKG:2291 Dividend Information

HKG:2291 has an annual dividend of 0.58 HKD per share, with a yield of 4.22%. The dividend is paid once per year and the last ex-dividend date was May 27, 2026.

Dividend Yield
4.22%
Annual Dividend
0.58 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
105.26%
Dividend Growth
-15.01%

Dividend History

Ex-Div Date AmountRecord DatePay Date
May 27, 20260.57255 HKDMay 28, 2026Jul 31, 2026
May 26, 20250.67366 HKDMay 27, 2025Jul 31, 2025
May 28, 20240.62594 HKDMay 29, 2024Jul 22, 2024
* Dividend amounts are adjusted for stock splits when applicable.

Dividend Charts