LEPU ScienTech Medical Technology (Shanghai) Co., Ltd. (HKG:2291)
10.49
-0.80 (-7.09%)
Sep 11, 2026, 4:08 PM HKT
HKG:2291 Dividend Information
HKG:2291 has an annual dividend of 0.58 HKD per share, with a yield of 4.39%. The dividend is paid once per year and the last ex-dividend date was May 27, 2026.
Dividend Yield
4.39%
Annual Dividend
0.58 HKD
Ex-Dividend Date
May 27, 2026
Payout Frequency
Annual
Payout Ratio
n/a
Dividend Growth(1Y)
-15.01%
Dividend History
* Dividend amounts are adjusted for stock splits when applicable.