Hong Kong · Delayed Price · Currency is HKD Ligent Technologies Company Description
Ligent Technologies, Inc. manufactures optical-communication and optical-interconnect products.
The company develops, manufactures, and sells optical transceivers, optical chips, and optical network terminals.
The company's optical chip products include distributed feedback (DFB) laser chips and electro-absorption modulated laser (EML) chips, including high-power continuous-wave DFB lasers.
It manufactures optical transceivers for AI and cloud applications. The company also offers data center interconnect solutions, including pluggable coherent transceivers, and storage and high-performance computing transceivers.
For broadband access and 5G fronthaul, the company provides Passive Optical Network OLT products in SFP-DD and QSFP form factors.
Its optical network terminal products cover mainstream standard-rate ONTs for broadband access and wireless coverage.
The company serves customers in China, the rest of Asia, North America, and Europe. Ligent Technologies, Inc. was formerly known as Hisense Broadband, Inc. and changed its name to Ligent Technologies, Inc. in November 2025.
Ligent Technologies, Inc. was founded in 2009 and is based in Qingdao, China.
| Country | Cayman Islands |
| Founded | 2002 |
| Industry | Communication Equipment |
| Sector | Technology |
| Employees | 5,852 |
| CEO | Jin Hong |
Contact Details
Address: 26th Floor, Building A Qingdao, 266071 China | |
| Website | ligent.com |
Stock Details
| Ticker Symbol | 9856 |
| Exchange | Hong Kong Stock Exchange |
| Fiscal Year | January - December |
| Reporting Currency | CNY |
| ISIN Number | KYG5486M1069 |
| SIC Code | 3670 |
Key Executives
| Name | Position |
|---|---|
| Jin Hong | Chief Executive Officer |
| Hui Wang | Chief Financial Officer |